In the compact world of smartphone engineering, board space is a premium luxury. This is why manufacturers rely on uMCP (Universal Multi-Chip Package) technology to stack high-speed storage and RAM into a single, tiny chip.
The Samsung KM8V8001JM-B813 is a prime example of this engineering marvel. It combines 128GB of UFS 2.1 Storage with 8GB of LPDDR4X RAM in a unified 254 FBGA package. It powers some of the most popular mid-range smartphones from 2020-2022, delivering the speed required for AI photography and 5G connectivity.
This guide explores the technical specifications, compatible devices, and repair alternatives for this critical component.
Table of Contents
- 1. Decoding the Silicon: KM8V8001JM-B813 Specs
- 2. Architecture: The Power of uMCP
- 3. Applications & Compatible Devices
- 4. Alternatives & Cross-Reference
- 5. Conclusion
1. Decoding the Silicon: KM8V8001JM-B813 Specs
The KM8V8001JM-B813 integrates high-speed NAND Flash and low-power DRAM vertically to save space and improve signal integrity.
Key Specifications Matrix
| Feature | Specification | Impact |
|---|---|---|
| Component Type | uMCP (UFS + LPDDR) | Saves ~40% PCB space compared to discrete chips. |
| Storage Capacity | 128 GB | UFS 2.1 Standard (High speed read/write). |
| DRAM Capacity | 8 GB (64 Gb) | LPDDR4X (Low Power DDR4). |
| DRAM Speed | 4266 Mbps | Supports high-bandwidth multitasking and gaming. |
| Package | 254 FBGA | Standard JEDEC footprint (11.5 x 13.0 mm). |
| Supply Voltage | 1.8V / 1.1V / 0.6V | Optimized for mobile battery life. |
Part Number Breakdown
- K: Samsung Memory.
- M: uMCP (UFS + LPDDR).
- 8V: Density Code (indicating the 128GB Storage + 8GB RAM combination).
- 8: Organization (x64 interface for LPDDR4X).
- 001: Generation code.
- J: UFS Revision (UFS 2.1).
- M: Temperature Range (Mobile standard).
- B813: Package type and Speed bin code.
Price Analysis & Stock Availability
As a component used in mass-produced phones, availability is generally good in the secondary and repair market.
Procurement Tip: Genuine chips are essential for successful motherboard repairs. [Check Stock for KM8V8001JM-B813 at Aichiplink] to view inventory from verified distributors.
2. Architecture: The Power of uMCP
Unlike older eMCP (which combined slower eMMC storage with RAM), the uMCP uses the UFS (Universal Flash Storage) interface.
UFS 2.1 vs eMMC: Why it Matters
- Parallel vs. Serial: eMMC is parallel (half-duplex), meaning it can only read or write at one time. UFS is serial (full-duplex), allowing simultaneous reading and writing.
- Speed: The UFS 2.1 controller in the KM8V8001JM allows for sequential read speeds up to 850 MB/s, vastly outperforming eMMC 5.1 (~250 MB/s). This results in faster app launching, smoother system boot times, and lag-free gallery scrolling.
3. Applications & Compatible Devices
This chip was the "sweet spot" for performance-focused mid-range phones released around 2020-2021.
Common Devices likely to use this chip (or compatible variants):
- Samsung Galaxy A71: The 8GB RAM / 128GB Storage variant heavily utilizes Samsung uMCPs.
- Redmi Note 9 Pro / Pro Max: Known to use 128GB+8GB uMCP configurations.
- Google Pixel 5: Often equipped with similar UFS+LPDDR4X combinations.
- Samsung Galaxy A51: Higher-tier versions.
- POCO X3: Select variants.
Repair Guide: BGA 254 Reballing
If you are repairing a dead motherboard (e.g., "stuck on logo" issues or "9008 mode"), replacing the uMCP is a common fix.
- Stencil: Requires a specific BGA 254 stencil.
- Temperature: Use leaded solder paste (183°C) for easier installation, or lead-free (217°C) for factory standard durability.
- Programmer: You will need a UFS programmer (like EasyJTAG Plus or Medusa Pro II) to write the boot partition data (LUN configuration) to the new chip before soldering.
4. Alternatives & Cross-Reference
Can't find the exact KM8V8001JM-B813? Here are compatible alternatives with the same BGA 254 footprint.
SK Hynix & Micron Equivalents
Other manufacturers produce uMCPs with the same 128GB/8GB configuration:
- SK Hynix: H9HQ15AECMBDAR-KEM (128GB UFS 2.1 + 8GB LPDDR4X).
- SK Hynix: H9HQ15AFAMBDAR-KEM.
- Micron: MT29VZZZBDA1SKPR-046 (Check specific revision compatibility).
Upgrading to UFS 2.2
You can often upgrade to the Samsung KM8V9001JM-B813.
- This is the UFS 2.2 version of the same chip.
- It features "WriteBooster" technology for faster write speeds.
- It maintains the same pinout and voltage requirements, making it a viable upgrade for skilled technicians looking to boost device performance.
5. Conclusion
The Samsung KM8V8001JM-B813 is a workhorse component that enabled the democratization of flagship-level performance in mid-range devices. With its 128GB UFS 2.1 storage and 8GB LPDDR4X memory, it remains a vital part for repair shops and engineers maintaining the lifecycle of popular smartphones.
Sourcing Mobile Memory ICs Need to replace a dead memory chip? Visit Aichiplink.com to search for KM8V8001JM-B813 and high-quality BGA 254 stencils.
Written by Jack Elliott from AIChipLink.
AIChipLink, one of the fastest-growing global independent electronic components distributors in the world, offers millions of products from thousands of manufacturers, and many of our in-stock parts is available to ship same day.
We mainly source and distribute integrated circuit (IC) products of brands such as Broadcom, Microchip, Texas Instruments, Infineon, NXP, Analog Devices, Qualcomm, Intel, etc., which are widely used in communication & network, telecom, industrial control, new energy and automotive electronics.
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Frequently Asked Questions
Is KM8V8001JM-B813 an eMMC or UFS chip?
It is a **uMCP** containing **UFS 2.1** storage. It is **not** an eMMC chip. You cannot use legacy eMMC programmers (like classic Riff Box) to read it; you need UFS-capable tools.
What does "64Gb" mean in the DRAM spec?
In memory datasheets, DRAM density is often written in **bits**. **64 Gigabits (Gb)** equals **8 Gigabytes (GB)**. So, this chip has 8GB of RAM.
Can I upgrade my phone's storage using this chip?
Theoretically, yes, if your phone supports the BGA 254 footprint and the CPU supports 128GB/8GB addressing. However, storage upgrades usually require reprogramming the UFS controller configuration and potentially modifying the phone's kernel/bootloader to recognize the larger RAM size.
What is the difference between KM8V8001JM and KM8F8001JM?
The **"F"** usually denotes a different density or UFS revision combo (e.g., often 256GB storage or different DRAM density). Always check the specific datasheet, as pinouts might be identical but firmware support varies by processor.
