In the high-stakes world of enterprise networking, the Broadcom StrataXGS® Trident 3 family stands as a benchmark for performance and flexibility. The BCM56172B0KFSBG is a critical component in this lineup, designed specifically to address the exploding bandwidth demands of modern campus networks driven by Wi-Fi 6, IoT, and high-density virtualization.
For network architects and hardware engineers, understanding the capabilities of the BCM56172 goes beyond simple port counts. It requires a look into its programmable pipeline and instrumentation capabilities. This guide provides a comprehensive overview of this high-performance Ethernet switch silicon.
Table of Contents
- BCM56172B0KFSBG Datasheet & Technical Specifications
- Architecture: Programmable Pipeline & Telemetry
- Applications in Enterprise Campus Networks
- Development Environment (SDK)
- Conclusion
BCM56172B0KFSBG Datasheet & Technical Specifications
The BCM56172B0KFSBG is part of the Trident 3 (TD3) series, often categorized under the campus-optimized "X7" or similar mid-range aggregation subsets. The suffix breakdown helps identify the part:
- BCM56: Broadcom Switch Product Line.
- 172: Specific SKU denoting throughput capacity (typically in the 720 Gbps to 1 Tbps range) and port configuration.
- B0: Silicon Revision (Stepping).
- KFSBG: Package type (RoHS compliant BGA) and commercial temperature rating.
Key Specifications Table
| Feature | Specification |
|---|---|
| Family | StrataXGS® Trident 3 |
| Process Technology | 16nm FinFET+ |
| Throughput | Scalable (Up to ~1.0 Tbps class) |
| SerDes Speeds | 10G / 25G / 50G PAM4 capable |
| Packet Buffer | Integrated Shared Buffer (Unified) |
| Programmability | Fully Programmable Pipeline |
| Interface Support | 10GbE, 25GbE, 40GbE, 100GbE |
The StrataXGS Trident 3 Advantage
The Trident 3 architecture brought a paradigm shift by introducing full programmability to the enterprise campus. Unlike fixed-function ASICs of the past, the BCM56172 allows for protocol upgrades in the field. This ensures that as new tunneling protocols or security features emerge, the hardware does not become obsolete.
For general knowledge on how network switches operate, you can refer to the Wikipedia article on Network Switches.
Price Analysis & Availability
Broadcom silicon is often subject to allocation and long lead times.
Note: The BCM56172 is a high-value component. [Check Stock for BCM56172B0KFSBG at Aichiplink] to view inventory from verified global distributors and secure parts for your production run.
Architecture: Programmable Pipeline & Telemetry
NPL (Network Programming Language) Support
The core strength of the BCM56172 lies in its support for NPL. This high-level language allows developers to define the behavior of the switch pipeline—parsing, lookups, and editing—without impacting the wire-speed performance. This is crucial for implementing custom forwarding logic or stripping/adding proprietary headers in data center interconnects.
In-Band Telemetry and Analytics
Modern networks require deep visibility. The Trident 3 series includes Broadcom's BroadView™ instrumentation. This allows for In-band Flow Analyzer (IFA) capabilities, providing real-time data on packet latency, buffer occupancy, and drop counters on a per-packet basis.
Applications in Enterprise Campus Networks
Aggregation Layer Design
The BCM56172 is ideally positioned for the Aggregation Layer.
- Downlinks: It can aggregate 10GbE or 25GbE links from access switches (which connect to Wi-Fi 6 APs).
- Uplinks: It provides high-speed 100GbE uplinks to the core network. This architecture eliminates bottlenecks caused by older Gigabit aggregation switches.
Thermal Management for High-Density Switches
Integrating high-performance silicon like the BCM56172 into a 1U chassis requires rigorous thermal design. The chip uses a high-pin-count Ball Grid Array (BGA) package. Efficient heat dissipation is critical, often requiring high-performance heatsinks and variable-speed fans to maintain the die temperature within the B0 revision's specified limits.
For engineers designing the PCB thermal relief, EEPower's guide on BGA Thermal Management provides essential insights into via placement and heatsink selection.
Development Environment (SDK)
Broadcom provides a comprehensive Software Development Kit (SDK) that abstracts the complex hardware registers.
- SDK APIs: Provide standard C-based function calls to configure ports, VLANs, and routing tables.
- Logical Table APIs (LTs): A newer approach in SDK6/SDKLT that treats switch resources as database tables, simplifying configuration management and automation.
- Access: Note that access to the full SDK and detailed hardware registers typically requires an NDA with Broadcom.
Conclusion
The BROADCOM BCM56172B0KFSBG is a powerhouse that enables the next generation of programmable, visible, and high-speed enterprise networks. Its ability to handle 25GbE/100GbE traffic with complex policy enforcement makes it an irreplaceable asset in modern switch design.
Sourcing High-End Broadcom Silicon Supply chains for enterprise silicon can be constrained. Ensure your project stays on track by sourcing from trusted suppliers. Visit Aichiplink.com to search for BCM56172B0KFSBG and other Broadcom networking solutions.
Written by Jack Elliott from AIChipLink.
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Frequently Asked Questions
What is the difference between Trident 3 and Tomahawk series?
**Trident 3** (including BCM56172) is feature-rich, offering deep buffers, extensive programmability, and complex features suitable for enterprise and service provider edge. **Tomahawk** is optimized for pure high-bandwidth, low-latency data center spine/leaf applications with a leaner feature set.
Can BCM56172 support VXLAN routing?
Yes, the StrataXGS Trident 3 architecture has native hardware support for VXLAN (Virtual Extensible LAN) routing and bridging, making it suitable for overlay networks in virtualized environments.
What does "B0" mean in the part number?
"B0" refers to the silicon stepping or revision. It indicates a mature revision of the silicon that may have fixed errata present in the "A0" version. It is generally the preferred revision for mass production.
Is this chip used in Layer 2 or Layer 3 switches?
The BCM56172 is a fully capable **Layer 3** switch chip. It supports advanced routing protocols like OSPF, BGP, and IPv4/IPv6 hardware routing at line rate.
Where can I download the datasheet?
Broadcom datasheets for the StrataXGS series are generally confidential and require a Broadcom support account (CSP) or NDA. However, product briefs are sometimes available publicly. For procurement and basic parametric data, you can consult distribution partners like **Aichiplink**.
