Table of Contents
- 1.0 MT40A2G16TBB-062E:F Specs: High-Density DDR4 Architecture
- 1.1 TwinDie™ Technology: Doubling Density in a 96-Ball FBGA
- 2.0 Performance Benchmarks: DDR4-3200 and 1.2V Efficiency
- 2.1 Timing and Latency: CL22 and 13.75ns Access Time
- 3.0 Thermal and Design Integration for Industrial Computing
- 4.0 Sourcing MT40A2G16TBB-062E:F: 2026 Price and Inventory Trends
1.0 MT40A2G16TBB-062E:F Specs: High-Density DDR4 Architecture
In the 2026 enterprise hardware landscape, the MT40A2G16TBB-062E:F remains a critical high-density solution for servers, high-end workstations, and AI edge nodes. As a 32Gb (Gigabit) DDR4 SDRAM component from Micron, this chip is organized as 2G x 16, providing a massive memory footprint in a single package.
The primary pain point for modern system designers is balancing memory capacity with limited PCB real estate. The MT40A2G16TBB-062E:F addresses this by utilizing a 16-bank architecture combined with high-speed differential clock inputs. According to 2026 supply chain audits, this specific 32Gb density has seen a 22% increase in deployment within the industrial automation and networking sectors. You can access the full technical datasheet and CAD models at aichiplink.com.
1.1 TwinDie™ Technology: Doubling Density in a 96-Ball FBGA
The "TwinDie" architecture is the standout feature of the MT40A2G16TBB-062E:F. By stacking two 16Gb dies into a single 96-ball FBGA (7.5mm x 13mm) package, Micron enables double the capacity of standard single-die components without increasing the surface area. This makes it the "gold standard" for space-constrained high-performance applications.
2.0 Performance Benchmarks: DDR4-3200 and 1.2V Efficiency
Performance is driven by the -062E speed grade, which corresponds to DDR4-3200 specifications. This allows for a peak data rate of 3200 MT/s, ensuring that data-heavy AI models and real-time analytics engines have the throughput they need.
2.1 Timing and Latency: CL22 and 13.75ns Access Time
With a CAS latency of 22 (CL=22) and a cycle time of 0.625ns, the chip achieves an impressive access time of approximately 13.75ns. Crucially, it operates at a nominal 1.2V, providing a significant power saving compared to older DDR3 or higher-voltage DDR4 variants, which is essential for 2026 sustainability targets in green data centers.
| Metric | Specification |
|---|---|
| Density | 32Gbit (TwinDie™) |
| Organization | 2G x 16 |
| Data Rate | 3200 MT/s |
| Voltage | 1.14V ~ 1.26V (1.2V Nom) |
| Operating Temp | 0°C to +95°C (TC) |
| Package | 96-ball FBGA (7.5x13) |
3.0 Thermal and Design Integration for Industrial Computing
Designing with the MT40A2G16TBB-062E:F requires careful thermal management, especially in high-density rack environments. The component is rated for an operating temperature of 0°C to 95°C.
For 2026 designs, we recommend using SPICE models (Z42B Rev F) for signal integrity simulation to handle the high-speed 1.6GHz clock signals. Proper PCB impedance control and thermal vias are mandatory to prevent signal jitter and maintain the 3200 MT/s data rate.
4.0 Sourcing MT40A2G16TBB-062E:F: 2026 Inventory Trends
As we move through early 2026, the market status of the MT40A2G16TBB-062E:F is categorized as Active but Mature. While Micron has shifted focus toward DDR5 for consumer PCs, this 32Gb DDR4 part remains the primary choice for long-lifecycle industrial and enterprise projects.
At aichiplink.com, we provide live inventory tracking and same-day shipping for verified MT40A2G16TBB-062E:F units, ensuring your production lines remain uninterrupted.
Conclusion
The MT40A2G16TBB-062E:F stands as the definitive high-density DDR4 solution for 2026, offering 32Gb of capacity in a compact TwinDie package. Its balance of 3200MT/s speed, 1.2V efficiency, and proven industrial reliability makes it indispensable for enterprise storage and networking infrastructure. While the industry transitions toward DDR5, the longevity and stable performance of the Micron Revision F silicon ensure its place in mission-critical hardware for years to come.
Written by Jack Elliott from AIChipLink.
AIChipLink, one of the fastest-growing global independent electronic components distributors in the world, offers millions of products from thousands of manufacturers, and many of our in-stock parts is available to ship same day.
We mainly source and distribute integrated circuit (IC) products of brands such as Broadcom, Microchip, Texas Instruments, Infineon, NXP, Analog Devices, Qualcomm, Intel, etc., which are widely used in communication & network, telecom, industrial control, new energy and automotive electronics.
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Frequently Asked Questions
What does the ":F" suffix mean in the part number?
The ":F" indicates the **Die Revision**. Revision F is one of the most stable and mature versions of Micron's 16Gb/32Gb DDR4 process, known for high yields and consistent timing performance.
Is MT40A2G16TBB-062E:F compatible with standard 1.2V DDR4 slots?
Yes, as long as the motherboard or memory controller supports 32Gb density components and the x16 organization. Most modern server CPUs (Xeon Scalable, EPYC) support this natively.
Can I use this for automotive designs?
This specific part is rated for 0°C to 95°C. For automotive applications, you should look for the "IT" (Industrial Temperature) or "AT" (Automotive Temperature) versions from Micron.
Where can I download the datasheet?
The full 32Gb TwinDie DDR4 datasheet is available at aichiplink.com.
What is the equivalent part number if this is out of stock?
Common substitutes include the **AS4C2G16D4-62BCN** from Alliance Memory, though timing parameters and Die Rev specifics should be verified for each application.
