If you pull apart a standard 4GB or 8GB DDR4 memory stick from a Dell workstation or an HP server manufactured around 2017-2019, chances are you will find this chip.
The Samsung K4A4G085WE-BCRC is the definition of an "Industry Standard" component.
It is a 4 Gigabit (512MB) DDR4 SDRAM chip organized in a x8 architecture. Unlike the specialized x16 chips used in soldered-down laptop memory, this x8 chip is the building block of the removable DIMM sticks that power the world's desktops and servers.
This guide decodes the part number and explains why this chip is crucial for hardware repair and manufacturing.
Table of Contents
- 1. Decoding the Part Number
- 2. Technical Specifications
- 3. Architecture: x8 vs x16 (Crucial for Repair)
- 4. Speed & Timings: Understanding "RC"
- 5. Sourcing & Replacement
- 6. Conclusion
1. Decoding the Part Number
Samsung's memory part numbers contain the entire spec sheet if you know how to read them. Here is the breakdown for K4A4G085WE-BCRC:
| Code Segment | Meaning | Detail |
|---|---|---|
| K4 | Memory | Samsung DRAM. |
| A | Type | DDR4 SDRAM (1.2V). |
| 4G | Density | 4 Gigabit. (512 Megabytes per chip). |
| 08 | Organization | x8 Bits. (8 Data I/O pins). Critical Spec. |
| 5 | Bank | 16 Banks. |
| W | Revision | W-die. (The specific silicon revision). |
| E | Package | FBGA (Flip Chip Ball Grid Array). |
| -BC | Temp/Power | Commercial (0°C ~ 85°C), Normal Power. |
| RC | Speed | DDR4-2400 (2400 Mbps). Timing: 17-17-17. |
2. Technical Specifications
- Capacity: 4Gb (512MB)
- Organization: 512M x 8
- Voltage: 1.2V $V_{DD}$
- Package: 78-ball FBGA
- Speed Grade: 2400 MT/s (PC4-19200)
3. Architecture: x8 vs x16 (Crucial for Repair)
Why does the "08" in the part number matter?
- x8 Chips (This Part): Have 8 data lines. To create a 64-bit wide interface (standard for PCs), you need 8 chips per rank.
- Found on: Almost all Desktop RAM (UDIMM) and Server RAM (RDIMM).
- Package: 78-Ball FBGA.
- x16 Chips: Have 16 data lines. You only need 4 chips to make a rank.
- Found on: Soldered Ultrabook memory, some Laptop SODIMMs.
- Package: 96-Ball FBGA.
Repair Tip: You cannot use this K4A4G085WE chip to replace a x16 chip on a laptop motherboard. The ball pattern and pinout are completely different. This chip is for repairing Memory Sticks (DIMMs).
4. Speed & Timings: Understanding "RC"
The suffix RC tells you the native speed bin of the chip.
- RC: DDR4-2400T (CL 17-17-17).
- PB: DDR4-2133P (CL 15-15-15).
- TD: DDR4-2666V (CL 19-19-19).
Can I mix them? Generally, yes. If you put this 2400MHz chip onto a stick with 2666MHz chips, the entire module will likely slow down to 2400MHz. However, for maximum stability (especially in servers), it is best to match the speed code exactly.
5. Sourcing & Replacement
This chip is a prime candidate for repairing high-value Server RDIMMs (e.g., 32GB or 64GB modules). If one chip fails, causing ECC errors, replacing the single K4A4G085WE chip is much cheaper than buying a new server module.
Warning on Revisions (Die Types): Samsung produces different "Dies" (B-die, C-die, E-die, W-die).
- This part is W-die.
- While JEDEC standards ensure basic compatibility, mixing different Dies on the same DIMM stick can cause timing training failures. Try to replace with the exact revision (WE) if possible.
6. Conclusion
The Samsung K4A4G085WE-BCRC is the backbone of the DDR4-2400 era. Whether you are manufacturing industrial controller boards or refurbishing enterprise server memory, understanding the x8 architecture and RC speed grade is key to a successful repair or design.
Sourcing Samsung DDR4 Components Need verified, oxidation-free memory chips for your repair lab? Visit Aichiplink.com to search for stock of K4A4G085WE-BCRC.
Written by Jack Elliott from AIChipLink.
AIChipLink, one of the fastest-growing global independent electronic components distributors in the world, offers millions of products from thousands of manufacturers, and many of our in-stock parts is available to ship same day.
We mainly source and distribute integrated circuit (IC) products of brands such as Broadcom, Microchip, Texas Instruments, Infineon, NXP, Analog Devices, Qualcomm, Intel, etc., which are widely used in communication & network, telecom, industrial control, new energy and automotive electronics.
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Frequently Asked Questions
Q1: What type of memory is Samsung K4A4G085WE-BCRC?
It is a 4Gb DDR4 SDRAM chip with a x8 data organization, commonly used on desktop and server DIMMs.
Q2: How much capacity does K4A4G085WE-BCRC provide?
Each chip provides 4Gb (512MB) of storage capacity.
Q3: What does x8 architecture mean in DDR4 memory?
x8 means the chip outputs 8 data bits, requiring 8 chips per rank for a standard 64-bit DIMM.
Q4: What package does K4A4G085WE-BCRC use?
It uses a 78-ball FBGA package, designed for removable RAM modules, not soldered laptop memory.
Q5: Can K4A4G085WE-BCRC replace x16 DDR4 memory chips?
No. x8 and x16 chips are not pin-compatible and cannot be interchanged.
