In the repair and manufacturing world, finding specific memory chips can be like finding a needle in a haystack. You often encounter part numbers that don't perfectly match the standard catalog, usually because they are OEM-specific revisions.
The SK Hynix H54G46CYRBX267N is one such component.
Widely used in embedded systems, automotive infotainment units, and set-top boxes, this chip is a high-reliability DRAM component. If you are looking to replace a faulty memory module or source components for a legacy board, understanding the specs hidden in this string is vital.
Table of Contents
- 1. Decoding the Part Number
- 2. Technical Specifications: 4Gb x16 Power
- 3. Hardware Considerations: The FBGA Package
- 4. Sourcing & Replacements
- 5. Conclusion
1. Decoding the Part Number
Let's break down the alphanumeric code based on SK Hynix's standard naming logic:
| Code Segment | Meaning | Analysis |
|---|---|---|
| H5 | Manufacturer | SK Hynix Memory. (DRAM Class). |
| 4G | Density | 4 Gigabit. This equals 512 Megabytes (MB) per chip. |
| 46 | Org/Type | Likely indicates x16 Organization (16-bit wide data bus). This is standard for embedded memory (vs x8 for PC RAM). |
| C | Generation | Die Revision. Indicates the specific silicon stepping (e.g., C-die). |
| Y | Package | FBGA (Ball Grid Array). RoHS Compliant. |
| RB | Material | Lead-Free / Halogen-Free / Commercial Temp. |
| X267N | Suffix | OEM/Speed Code. This section often defines specific timing parameters (CAS Latency) or operating temperature specific to a client. |
2. Technical Specifications: 4Gb x16 Power
The defining feature of the H54G46... series is its architecture.
1. x16 Organization
Most desktop memory sticks use x8 chips (8 data pins). However, the H54G46 is a x16 chip.
- Why it matters: It allows engineers to build a 32-bit wide memory bus using only 2 chips (16 + 16 = 32). This saves massive amounts of space on PCBs for routers, TVs, and car dashboards.
2. Density
4 Gigabits (512MB) is a "Sweet Spot" density. It is large enough to run a Linux kernel and a GUI, but cheap enough for consumer electronics.
3. Interface
While the exact suffix X267N is rare, chips starting with H54G or H5TQ are typically DDR3 or DDR3L (1.35V). Ensure you measure the voltage rail on your PCB (1.5V vs 1.35V) before replacing.
3. Hardware Considerations: The FBGA Package
Replacing this chip is not a soldering iron job.
- Package Type: FBGA (Fine-Pitch Ball Grid Array).
- Connections: The connections are solder balls underneath the chip.
- Repair Tooling: You need a Hot Air Rework Station or an IR Reflow Oven.
- Stencil: If you are buying "Pulled" (used) chips, you must reball them using a standard DDR3/4 x16 Stencil.
4. Sourcing & Replacements
Since H54G46CYRBX267N might be an OEM-specific number, you may not find brand new stock easily. You can often use compatible parts from the same family if the specs match.
Potential Substitutes (Check Datasheets First!):
- SK Hynix H5TQ4G63CFR: The standard market version of 4Gb x16 DDR3.
- Micron MT41K256M16: A Micron equivalent (4Gb x16 DDR3L).
- Samsung K4B4G1646E: Samsung's 4Gb x16 variant.
Critical Check: always verify the Voltage (1.35V vs 1.5V) and Speed Grade (1600MHz vs 1866MHz) before swapping.
5. Conclusion
The SK Hynix H54G46CYRBX267N is a workhorse component in the embedded world. Its high density (4Gb) and wide bus (x16) make it irreplaceable in compact electronics. For repair technicians, identifying it as a standard SK Hynix DRAM allows you to find viable replacements even if this exact part number is out of stock.
Sourcing SK Hynix Memory? Need verified stock for your production or repair needs? Visit Aichiplink.com to search for H54G46 series and compatible DRAM components.
Written by Jack Elliott from AIChipLink.
AIChipLink, one of the fastest-growing global independent electronic components distributors in the world, offers millions of products from thousands of manufacturers, and many of our in-stock parts is available to ship same day.
We mainly source and distribute integrated circuit (IC) products of brands such as Broadcom, Microchip, Texas Instruments, Infineon, NXP, Analog Devices, Qualcomm, Intel, etc., which are widely used in communication & network, telecom, industrial control, new energy and automotive electronics.
Empowered by AI, Linked to the Future. Get started on AIChipLink.com and submit your RFQ online today!
Frequently Asked Questions
Q1: What type of memory is H54G46CYRBX267N?
It is a 4Gb SK Hynix DRAM chip with a x16 data bus, commonly used in embedded systems.
Q2: How much capacity does a 4Gb memory chip provide?
4Gb equals 512MB (Megabytes) of memory per chip.
Q3: What does x16 organization mean in DRAM?
x16 means the chip transfers 16 bits per clock cycle, reducing the number of chips needed on a PCB.
Q4: What package type does H54G46CYRBX267N use?
It comes in an FBGA (Fine-Pitch Ball Grid Array) package, requiring hot-air or reflow soldering.
Q5: Can H54G46CYRBX267N be replaced with another DRAM chip?
Yes, as long as the density, x16 organization, voltage, and speed grade match, compatible SK Hynix, Samsung, or Micron parts can be used.
