KLMBG4JETD Samsung eMMC: Specs, Capacity & Alternatives

Part Number Decoder

KLMBG4JETD = Samsung 64GB eMMC 5.1 memory chip

Decode Each Character:

K  L  M  B  G  4  J  E  T  D
│  │  │  │  │  │  │  │  │  └─ D = FBGA Package (11.5×13mm)
│  │  │  │  │  │  │  │  └──── T = Industrial temp (-25°C to +85°C)
│  │  │  │  │  │  │  └─────── E = 1.8V / 3.3V dual voltage
│  │  │  │  │  │  └────────── J = DDR52 (eMMC 5.1, 200 MB/s)
│  │  │  │  │  └───────────── 4 = 64GB density
│  │  │  │  └──────────────── G = Generation code
│  │  │  └─────────────────── B = Memory type (eMMC)
│  │  └────────────────────── M = NAND Flash
│  └───────────────────────── L = Logic die integrated
└──────────────────────────── K = Samsung memory product

Quick Summary: 64GB eMMC 5.1, DDR52 interface, 153-ball FBGA package, industrial temperature range.

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Quick Specs Card

Parameter	Value
Capacity	64GB (59.6 GiB usable)
Interface	eMMC 5.1
Speed Class	HS400 (200 MB/s)
Bus Mode	8-bit DDR52
Sequential Read	250 MB/s (typ)
Sequential Write	90 MB/s (typ)
Random Read	8,000 IOPS
Random Write	6,000 IOPS
Voltage	1.8V I/O, 3.3V VCC option
Package	153-ball FBGA (11.5×13mm)
Ball Pitch	0.5mm
Temperature	-25°C to +85°C
Endurance	3,000 P/E cycles (MLC)
Manufacturer	Samsung
Series	KLM Series

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Detailed Specifications

Performance

Sequential Performance:

• Read: Up to 250 MB/s (HS400 mode)
• Write: Up to 90 MB/s (sustained)

Random Performance:

• Random Read (4KB): 8,000 IOPS
• Random Write (4KB): 6,000 IOPS

Speed Modes Supported:

• HS400 (DDR200, 200 MHz clock) ← Primary mode
• HS200 (SDR200, 200 MHz clock)
• DDR52 (52 MHz clock, double data rate)
• High-Speed (52 MHz clock)

Electrical Specifications

Voltage:

• VCC: 2.7V - 3.6V (typical 3.3V)
• VCCQ: 1.7V - 1.95V (typical 1.8V I/O)
• VCC option: 1.8V capable for low-power designs

Current Consumption:

• Active Read: 150 mA @ HS400 mode
• Active Write: 180 mA @ HS400 mode
• Standby: 1-3 mA
• Sleep: 100 µA typical

Physical Specifications

Package: 153-ball FBGA

• Dimensions: 11.5mm × 13mm × 1.0mm (L×W×H)
• Ball Pitch: 0.5mm
• Weight: ~0.15g

Ball Count: 153 balls

• Data: 8-bit bus (D0-D7)
• Command: CMD pin
• Clock: CLK pin
• Power: Multiple VCC, VCCQ, GND balls

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Package & Ball Map

153-Ball FBGA Layout

Key Ball Locations (simplified):

       A  B  C  D  E  F  G  H  J  K  L  M  N  P  R
    ┌──────────────────────────────────────────────┐
  1 │                                               │
  2 │     [Power & Ground balls distributed]       │
  3 │                                               │
  4 │           [Data Bus: D0-D7]                   │
  5 │           [CMD, CLK, RST_n]                   │
  6 │           [Control signals]                   │
  7 │                                               │
  8 │     [VCC, VCCQ, VSS distribution]            │
  9 │                                               │
    └──────────────────────────────────────────────┘

Ball pitch: 0.5mm
Package size: 11.5×13mm

Critical Balls:

• CLK: Clock input (up to 200 MHz)
• CMD: Command line
• D0-D7: 8-bit data bus
• RST_n: Reset (active low)
• VCC: 3.3V power supply
• VCCQ: 1.8V I/O power
• VSS: Ground (multiple balls)

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Speed Class & Performance

eMMC 5.1 Features

Supported by KLMBG4JETD:

• ✅ HS400 Enhanced Strobe (best performance)
• ✅ HS200 (single data rate 200 MHz)
• ✅ DDR52 (double data rate 52 MHz)
• ✅ Command Queuing (up to 32 commands)
• ✅ Cache (write acceleration)
• ✅ Background Operations (bkops)
• ✅ TRIM support
• ✅ Secure erase

Real-World Performance

Android Phone Application:

Boot time: 8-12 seconds (typical with 64GB eMMC 5.1)
App launch: 0.5-1.5 seconds for large apps
File copy: 70-90 MB/s sustained write (large files)

Comparison to Other Storage:

KLMBG4JETD (eMMC 5.1): 250 MB/s read
UFS 2.1: 850 MB/s read (3.4× faster)
UFS 3.0: 2,100 MB/s read (8× faster)

Note: eMMC 5.1 sufficient for mid-range devices

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Compatible Alternatives

Direct Samsung Replacements (Same Capacity)

Part Number	Capacity	Speed	Difference
KLMBG4JETD-B041	64GB	eMMC 5.1	Same (full part #)
KLMBG4FETA-B041	64GB	eMMC 5.0	Slower (HS200 max)
KLMBG4WEBC-B031	64GB	eMMC 5.1	Similar, different package

Other Capacity Options (Samsung KLM Series)

Part Number	Capacity	Speed	Use Case
KLMBG2JETD-B041	32GB	eMMC 5.1	Budget phones
KLMBG4JETD-B041	64GB	eMMC 5.1	Mid-range
KLMCG4JETD-B041	128GB	eMMC 5.1	High-end phones
KLMDG4UCTA-B041	256GB	eMMC 5.1	Flagship (rare)

Cross-Brand Alternatives

Manufacturer	Part Number	Capacity	Compatibility
Micron	MTFC64GB	64GB eMMC 5.1	✅ 95% compatible
SK Hynix	H26M64208EMR	64GB eMMC 5.1	✅ 90% compatible
Kingston	EMMC64G-M325	64GB eMMC 5.1	✅ 90% compatible
SanDisk	SDIN9DW2-64G	64GB eMMC 5.1	⚠️ 85% (different features)

Note: Pin-compatible but may have different command timing. Test thoroughly before mass production.

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Application Examples

Smartphones Using KLMBG4JETD

Confirmed Devices:

• Huawei Honor 8X (2018) - 64GB variant
• Xiaomi Redmi Note 7 (2019) - 64GB model
• OPPO A7 (2018) - 64GB version
• Samsung Galaxy M20 (2019) - 64GB storage

Typical Phone Specs (with KLMBG4JETD):

• Price tier: $150-$300 (mid-range)
• RAM: 4GB-6GB
• SoC: Snapdragon 600-700 series or Kirin 710
• Use: Mid-range Android phones

Other Applications

Tablets:

• Android tablets (10-inch, mid-range)
• Educational tablets
• Entry-level iPads (some variants use similar eMMC)

Embedded Systems:

• Industrial HMI (Human-Machine Interface)
• Point-of-Sale (POS) terminals
• Digital signage
• Automotive infotainment (entry-level)

IoT Devices:

• Smart home hubs (requiring large storage)
• Edge AI devices
• Media streamers

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Common Specifications Comparison

Samsung KLM Series eMMC 5.1

Part Number	Capacity	Read	Write	Package	Temp
KLMBG2JETD	32GB	250 MB/s	60 MB/s	153-ball	-25~85°C
KLMBG4JETD	64GB	250 MB/s	90 MB/s	153-ball	-25~85°C
KLMCG4JETD	128GB	250 MB/s	90 MB/s	153-ball	-25~85°C
KLMDG4UCTA	256GB	250 MB/s	125 MB/s	153-ball	-25~85°C

Key Observation: Read speed constant across capacities, write speed increases with higher density.

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Design Considerations

PCB Layout

Trace Requirements:

• Clock (CLK): 50Ω controlled impedance
• Data bus (D0-D7): 50Ω ± 10%
• Length matching: ± 10mm (clock to data)
• Keep traces <100mm for HS400 mode

Power Supply:

VCC (3.3V):
├─ 0.1µF ceramic (close to each VCC ball)
├─ 1µF ceramic (nearby)
└─ 10µF ceramic (bulk)

VCCQ (1.8V):
├─ 0.1µF ceramic (close to each VCCQ ball)
└─ 1µF ceramic (nearby)

Thermal Management

Operating Temperature: -25°C to +85°C

Thermal Dissipation:

• Active power: ~0.5W (HS400 sustained write)
• Thermal pad recommended for high-duty-cycle applications
• Passive cooling usually sufficient for smartphone applications

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Common Issues & Solutions

Issue 1: Device Not Detected

Symptoms: eMMC not recognized by host

Possible Causes:

1. Power supply not stable (check VCC, VCCQ)
2. Clock speed too fast for PCB layout
3. Ball joint failure (BGA solder)

Solutions:

• Verify VCC = 3.3V ± 5%, VCCQ = 1.8V ± 5%
• Reduce clock to 25 MHz for testing
• Reball/reflow with proper temperature profile

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Issue 2: Slow Performance

Symptoms: Read/write slower than expected

Possible Causes:

1. Operating in compatibility mode (not HS400)
2. Cache disabled
3. Thermal throttling

Solutions:

• Check host controller supports HS400
• Enable write cache in software
• Improve thermal design

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Issue 3: Data Corruption

Symptoms: Files corrupted after write

Possible Causes:

1. Power loss during write
2. End-of-life (exceeded P/E cycles)
3. Voltage drop during write

Solutions:

• Add power-loss protection capacitor
• Check P/E cycle count (if >3,000, consider replacement)
• Ensure clean, stable power supply

Quick Reference Summary

At-a-Glance

✅ Capacity: 64GB (59.6 GiB usable) ✅ Speed: 250 MB/s read, 90 MB/s write ✅ Interface: eMMC 5.1, HS400 mode ✅ Package: 153-ball FBGA, 11.5×13mm ✅ Voltage: 3.3V VCC, 1.8V VCCQ ✅ Temperature: -25°C to +85°C ✅ Applications: Mid-range phones, tablets, embedded ✅ Alternatives: KLMCG4JETD (128GB), Micron MTFC64GB

Part Number Breakdown

K = Samsung LM = Logic + Memory integrated B = eMMC type G = Generation 4 = 64GB J = DDR52/eMMC 5.1 E = Dual voltage T = Industrial temp D = FBGA package

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Conclusion

KLMBG4JETD is a reliable Samsung 64GB eMMC 5.1 chip widely used in mid-range smartphones and embedded systems. With 250 MB/s read speed, HS400 interface support, and industrial temperature range, it offers solid performance for devices requiring moderate storage capacity. Pin-compatible alternatives exist (Micron MTFC64GB, SK Hynix H26M64208EMR), and upgrading to 128GB (KLMCG4JETD) is straightforward due to identical package dimensions.

For embedded system design, PCB layout guidelines, and cross-reference tools, visit AiChipLink.com.

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Written by Jack Elliott from AIChipLink.

 

AIChipLink, one of the fastest-growing global independent electronic   components distributors in the world, offers millions of products from thousands of manufacturers, and many of our in-stock parts is available to ship same day.

 

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