MT40A1G16TB-062: Technical Guide to Micron 16Gb DDR4 Server Memory

Introduction

The MT40A1G16TB-062 is a 16-gigabit DDR4 SDRAM manufactured by Micron Technology, operating at 3200 MT/s (DDR4-3200) with x16 organization optimized for enterprise server, data center, and high-performance computing applications requiring high-density memory with robust error correction and reliability features.

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Technical Overview

Core Specifications

Parameter	Specification
Density	16Gb (2GB)
Organization	1024M × 16 (x16)
Data Rate	3200 MT/s (DDR4-3200)
Voltage	1.2V (VDD, VDDQ)
CAS Latency	CL22 (22-22-22)
Package	96-ball FBGA
Operating Temp	0°C to +95°C
Technology	DDR4 SDRAM

Part Number Decoder

MT40A1G16TB-062:

• MT40A = Micron DDR4 family
• 1G = 1 Giga (1024M) depth
• 16 = x16 organization (16-bit width)
• TB = Technology/feature code
• 062 = Speed grade (3200 MT/s, CL22)

Key Features

High Density:

• 16Gb per die enables high-capacity DIMMs
• Typical configuration: 8× 16Gb = 16GB DIMM (single-rank)
• Dual-rank: 16× 16Gb = 32GB DIMM

DDR4-3200 Performance:

• 3200 MT/s data rate
• 25.6 GB/s bandwidth per module (64-bit)
• CL22 latency (~13.75 ns)

Reliability Features:

• On-die ECC (internal error correction)
• CRC (Cyclic Redundancy Check)
• CAP (Command/Address Parity)
• RAS (Reliability, Availability, Serviceability) features

Power Efficiency:

• 1.2V operation (DDR4 standard)
• Low-power modes (self-refresh, power-down)
• Temperature-controlled refresh

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Complete Specifications

Memory Organization

Parameter	Value
Total Density	16Gb (16,384 Mb)
Configuration	1024M × 16-bit
Banks	16 banks (4 bank groups × 4 banks)
Page Size	2KB (1K columns × 16-bit)
Refresh	64ms (auto-refresh)

Timing Specifications (DDR4-3200, CL22)

Parameter	Value	Unit
Clock Frequency	1600	MHz
Data Rate	3200	MT/s
CAS Latency (CL)	22	clocks
tRCD (RAS to CAS)	22	clocks
tRP (Precharge)	22	clocks
Cycle Time (tCK)	0.625	ns
CAS Latency Time	13.75	ns

Electrical Specifications

Parameter	Min	Typ	Max	Unit
VDD (Supply)	1.14	1.2	1.26	V
VDDQ (I/O)	1.14	1.2	1.26	V
VPP (Wordline)	2.375	2.5	2.75	V
IDD Operating	-	~50	~80	mA

Package Information

Parameter	Value
Package Type	96-ball FBGA
Dimensions	13.5mm × 10mm
Ball Pitch	0.8mm
Height	1.0mm (low profile)

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Applications

Enterprise Servers

Data Center Servers:

• Dual-socket Xeon/EPYC platforms
• High-capacity memory configurations (512GB-2TB)
• Database servers (Oracle, SQL Server, PostgreSQL)
• Virtualization hosts (VMware, Hyper-V)

Typical Configuration:

• 16GB RDIMM: 8× MT40A1G16TB-062 (single-rank)
• 32GB RDIMM: 16× MT40A1G16TB-062 (dual-rank)
• 8 DIMMs per CPU socket = 128-256GB per socket

Cloud Computing

Public/Private Cloud:

• AWS EC2 instance types (M5, R5, C5)
• Azure virtual machines
• Google Cloud Compute Engine
• OpenStack infrastructure

Benefits:

• High density reduces server count
• DDR4-3200 improves VM performance
• ECC prevents data corruption

High-Performance Computing (HPC)

Scientific Computing:

• Computational Fluid Dynamics (CFD)
• Molecular dynamics simulations
• Weather modeling
• Financial analytics

Memory Requirements:

• Large datasets in-memory
• High bandwidth (25.6 GB/s per module)
• Low latency (13.75 ns CL22)

Storage Systems

Enterprise Storage:

• NAS (Network Attached Storage)
• SAN (Storage Area Network)
• Software-defined storage
• Cache acceleration

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Implementation Guide

DIMM Configuration

Single-Rank 16GB RDIMM:

8× MT40A1G16TB-062 (16Gb each)
= 8 × 2GB = 16GB total
Organization: x72 (64-bit data + 8-bit ECC)
Rank: Single-rank

Dual-Rank 32GB RDIMM:

16× MT40A1G16TB-062 (16Gb each)
= 16 × 2GB = 32GB total
Organization: 2 ranks × x72
Rank: Dual-rank

Server Memory Topology

Dual-Socket Server (16 DIMM slots):

CPU 0: 8 channels × 1 DIMM = 8× 32GB = 256GB
CPU 1: 8 channels × 1 DIMM = 8× 32GB = 256GB
Total: 512GB system memory
Bandwidth: 8 ch × 25.6 GB/s = 204.8 GB/s per CPU

Performance Optimization

Best Practices:

• Populate all memory channels equally
• Use matched DIMM sets (speed, capacity, rank)
• Enable XMP/DOCP for validated timings
• Monitor temperature (keep <85°C)

Reliability Features

ECC Protection:

• On-die ECC corrects single-bit errors internally
• DIMM-level ECC (x72) adds additional protection
• Combined: Enhanced data integrity

RAS Features:

• Memory scrubbing (periodic ECC checks)
• Demand/patrol scrubbing
• SDDC (Single Device Data Correction)
• ADDDC (Adaptive Double Device Data Correction)

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Comparison

vs DDR4-2933 (Previous Generation)

Feature	DDR4-3200 (MT40A1G16TB-062)	DDR4-2933
Data Rate	3200 MT/s	2933 MT/s
Bandwidth	25.6 GB/s	23.5 GB/s
CAS Latency	CL22 (13.75 ns)	CL21 (14.32 ns)
Performance	+9% bandwidth	Baseline

Benefit: 9% higher bandwidth with slightly better latency.

vs DDR5-4800 (Next Generation)

Feature	DDR4-3200 (MT40A1G16TB-062)	DDR5-4800
Data Rate	3200 MT/s	4800 MT/s
Voltage	1.2V	1.1V
Bandwidth	25.6 GB/s	38.4 GB/s
Cost	Mature pricing	Premium
Availability	Widespread	Growing

Trade-off: DDR4-3200 remains cost-effective for current-gen platforms.

Conclusion

The MT40A1G16TB-062 delivers proven DDR4-3200 performance with 16Gb density and x16 organization, enabling cost-effective 16GB/32GB registered DIMMs for enterprise servers, cloud infrastructure, and HPC systems. With on-die ECC, RAS features, and wide platform support, it provides the reliability and capacity required for mission-critical data center workloads.

Key Advantages:

✅ 16Gb Density: Enables high-capacity RDIMMs (16GB/32GB)
✅ DDR4-3200: 25.6 GB/s bandwidth, CL22 latency
✅ ECC/RAS: On-die ECC + DIMM-level protection
✅ Wide Compatibility: Intel Xeon, AMD EPYC platforms
✅ Proven Technology: Mature, cost-effective DDR4
✅ Micron Quality: Enterprise-grade reliability

Designing server systems? Visit AiChipLink.com for DDR4 memory sourcing and configuration consultation.

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Written by Jack Elliott from AIChipLink.

 

AIChipLink, one of the fastest-growing global independent electronic   components distributors in the world, offers millions of products from thousands of manufacturers, and many of our in-stock parts is available to ship same day.

 

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