XCAU15P-1FFVB676I FPGA Review: Specs, Pinout, Price & Design Guide

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Introduction

If you are building a modern networking, AI acceleration, or high-bandwidth data processing system, choosing the right FPGA can easily become the most expensive—and risky—decision in your entire design.

The XCAU15P-1FFVB676I is one of the most capable members of AMD (Xilinx) UltraScale+ families, frequently selected for projects where logic density, memory bandwidth, and I/O flexibility must scale together.

According to recent semiconductor market data, high-end programmable logic devices grew by more than 9% globally in 2024, driven mainly by cloud infrastructure and edge AI platforms. Even more striking, over 60% of new data-plane designs now integrate at least one high-end FPGA to offload real-time workloads.

In this guide, you’ll learn exactly what the XCAU15P-1FFVB676I offers, how its FFVB676 package impacts your PCB design, how it compares to similar devices, and how to source it safely for production.

Let’s walk through specifications, pinout, performance, pricing, and real engineering decisions—step by step.

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1.0 What Is XCAU15P-1FFVB676I And Why It Matters

The XCAU15P-1FFVB676I is a high-capacity UltraScale+ FPGA device designed for demanding digital processing platforms.

At its core, it combines:

• High logic density
• Large on-chip memory resources
• High-speed transceivers
• Advanced clocking and power management

What makes this device stand out is its balance between scalable compute fabric and system-level connectivity, making it ideal for:

• High-throughput networking
• Data acquisition
• Image and video processing
• Custom accelerators

For background on FPGA fundamentals, you can refer to the authoritative resource
FPGA on Wikipedia:
https://en.wikipedia.org/wiki/Field-programmable_gate_array

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1.1 UltraScale+ Architecture Explained

The device is built on AMD Xilinx’s UltraScale+ architecture, which introduces:

• Improved logic utilization
• Higher DSP performance per watt
• Better clocking and routing efficiency

Think of the architecture like a city grid. Earlier FPGA families added more buildings, but UltraScale+ redesigned the streets so traffic flows faster—even when the city gets bigger.

Key architectural advantages include:

• Advanced CLB structure
• Dedicated DSP slices for signal processing
• Optimized block RAM and UltraRAM

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1.2 Typical Applications And Market Demand

You will most often see XCAU15P-1FFVB676I in:

• High-speed Ethernet switches and routers
• Industrial vision platforms
• Test and measurement equipment
• AI inference and data-preprocessing cards

If you are developing industrial platforms, you may also find this article useful:
industrial embedded computing solutions –

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2.0 XCAU15P-1FFVB676I Datasheet And Core Specifications

When engineers search for XCAU15P-1FFVB676I datasheet, they usually want one thing: a clear picture of usable resources.

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2.1 Logic, DSP And Memory Resources

The device delivers:

• High programmable logic capacity
• Hundreds of DSP slices
• Large internal RAM blocks

In real systems, this translates into:

• Parallel packet processing
• Multi-channel signal pipelines
• On-chip buffering without external memory

Key highlights:

• High logic density FPGA
• Integrated DSP acceleration
• Large on-chip memory resources

For memory interface background, see
DDR SDRAM on Wikipedia:
https://en.wikipedia.org/wiki/DDR_SDRAM

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2.2 High-Speed Transceivers And Interfaces

Modern systems are defined by bandwidth. This device supports:

• Multi-gigabit serial transceivers
• High-speed memory interfaces
• Flexible clocking domains

If you are working on high-speed links, you may want to explore our related guide:
high-speed serial interface ICs

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3.0 XCAU15P-1FFVB676I Pinout And FFVB676 Package Guide

The XCAU15P-1FFVB676I pinout and package selection directly affect board cost, layer count, and routing risk.

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3.1 I/O Bank Structure And Voltage Planning

The device organizes I/O into multiple banks, each with its own supply requirements.

You should plan carefully for:

• I/O bank voltage compatibility
• Differential pair placement
• Shared reference voltages

Design tips:

• Keep bank voltage rails isolated
• Group similar interfaces per bank
• Reserve spare I/O for future expansion

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3.2 Mechanical And PCB Footprint Notes

The FFVB676 package:

• Uses a fine-pitch BGA
• Requires controlled impedance routing
• Benefits from blind or buried vias

For many first-time users, this package increases PCB cost by 15–25% compared with mid-pin-count packages.

If you are new to BGA layout, this reference on
ball grid array from Wikipedia is helpful:
https://en.wikipedia.org/wiki/Ball_grid_array

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4.0 Performance, Power And Comparison With XCAU10P

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4.1 Power Consumption And Thermal Design

The XCAU15P-1FFVB676I power consumption depends heavily on:

• Toggle rate
• Transceiver usage
• On-chip memory activity

Typical design strategies include:

1. Early power estimation using vendor tools
2. Power rail segmentation
3. Airflow and heat-sink planning

“Thermal margin is not a luxury—it is your production insurance.”

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4.2 XCAU15P vs XCAU10P

Feature	XCAU15P	XCAU10P
Logic capacity	Higher	Medium
DSP resources	More	Fewer
Suitable workloads	Heavy data plane	Control + moderate data
Power budget	Higher	Lower
Typical cost	Higher	Lower

If your workload is mostly control-oriented, XCAU10P may be enough. But for multi-lane processing, XCAU15P-1FFVB676I offers far more headroom.

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5.0 Price, Availability And Sourcing Strategy

[Insert image: FPGA market pricing trend chart – alt="XCAU15P-1FFVB676I market price trend"]

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5.1 Market Price And Lead Time

The XCAU15P-1FFVB676I price varies significantly depending on:

• Order volume
• Contract vs spot sourcing
• Regional availability

In 2024–2025, high-end FPGAs typically show:

• Lead times from 16 to 32 weeks
• Volatile spot pricing

To monitor safe sourcing, check our component market insights:
electronic component market trends

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5.2 Alternatives And Lifecycle Status

The device currently remains in active production.

Common alternatives include:

• Lower-density UltraScale+ parts
• Versal adaptive SoCs (for heterogeneous workloads)

However, migration usually requires:

• New board design
• Software refactoring
• Toolchain updates

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6.0 How To Select XCAU15P-1FFVB676I For Your Design

Here is a simple selection checklist:

1. Confirm logic and DSP requirements
2. Validate FFVB676 package routing capability
3. Estimate power and cooling
4. Verify interface counts
5. Secure supply commitments early

A short practical video walkthrough on UltraScale+ design flow is below.

Conclusion

The XCAU15P-1FFVB676I stands out as a highly capable solution for modern data-centric platforms where performance, scalability, and interface density must coexist in a single programmable device.

More importantly, this FPGA is not just about raw resources. Its real value comes from how efficiently you can translate logic, memory, and transceivers into reliable system throughput—while still keeping thermal and sourcing risks under control.

As networking infrastructure, edge computing, and AI-assisted systems continue to grow through 2025 and beyond, high-capacity programmable logic devices like XCAU15P will remain central to flexible hardware architectures.

If you are planning a new design or need help sourcing this device safely for production, explore our component intelligence platform at https://aichiplink.com and start building a secure, future-proof supply strategy today.

Search XCAU15P-1FFVB676I Stock Now

 

 

 

 

 

Written by Jack Elliott from AIChipLink.

 

AIChipLink, one of the fastest-growing global independent electronic   components distributors in the world, offers millions of products from thousands of manufacturers, and many of our in-stock parts is available to ship same day.

 

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