In the era of 512GB smartphones, a 4GB storage chip might seem tiny. But in the world of Internet of Things (IoT), Industrial Automation, and Automotive dashboards, 4GB is the perfect "Goldilocks" size—large enough for a Linux OS, but cheap enough to keep BOM costs low.
The Samsung KLM4G1FETE-B041 is the industry standard for this capacity.
It is an eMMC 5.1 (embedded MultiMediaCard) solution that integrates high-reliability MLC NAND and a sophisticated controller into a single BGA package. If you are designing a smart gateway or repairing a legacy industrial controller, this is likely the chip you are dealing with.
This guide decodes its specs and explains why it remains a top choice for embedded designers.
Table of Contents
- 1. Decoding the Part Number
- 2. Technical Specs: The Power of eMMC 5.1
- 3. Endurance: MLC vs. TLC
- 4. Hardware Considerations: FBGA-153
- 5. Sourcing & Replacements
- 6. Conclusion
1. Decoding the Part Number
Samsung's eMMC part numbers are packed with technical details. Here is the breakdown for KLM4G1FETE-B041:
| Code Segment | Meaning | Detail |
|---|---|---|
| KLM | Product | eMMC (Embedded MultiMediaCard). |
| 4G | Density | 4 GByte (32 Gigabit). |
| 1 | Mode | NAND + Controller (Standard eMMC). |
| F | Generation | F-die (Specific Silicon Generation). |
| E | Tech | MLC (Multi-Level Cell). Critical for endurance. |
| TE | Voltage | Dual Voltage (1.8V/3.3V I/O). |
| B041 | Package | FBGA-153. (11.5 x 13 mm). Industrial Temp. |
2. Technical Specs: The Power of eMMC 5.1
While older devices used eMMC 4.5, the KLM4G1FETE-B041 uses the newer eMMC 5.1 standard.
- HS400 Interface: Supports data transfer rates up to 400 MB/s (Interface speed). Real-world sequential reads are typically ~280-300 MB/s.
- Command Queuing (CQ): Just like SSDs (NCQ), this feature allows the eMMC to process multiple read/write commands out of order for maximum efficiency. This makes the OS feel "snappier" compared to older eMMC 4.5 chips.
- Field Firmware Update (FFU): Allows the eMMC controller firmware to be patched in the field, fixing bugs without replacing the chip.
3. Endurance: MLC vs. TLC
For industrial applications, Flash Endurance is the #1 concern.
- TLC (Triple-Level Cell): Stores 3 bits per cell. Cheap, but low endurance (~500-1000 cycles). Used in consumer USB drives.
- MLC (Multi-Level Cell) - This Chip: Stores 2 bits per cell.
- Endurance: Typically 3,000 Program/Erase cycles.
- Data Retention: Superior to TLC, especially at high temperatures (e.g., inside a car dashboard or factory machine).
Why it matters: If your IoT device is logging sensor data 24/7, a TLC chip might die in 2 years. This MLC chip is designed to last the 10+ year lifecycle of industrial products.
4. Hardware Considerations: FBGA-153
This chip uses the standard JEDEC 153-ball FBGA footprint.
- Dimensions: 11.5mm x 13.0mm x 0.8mm.
- Pinout:
- DAT0-DAT7: 8-bit Data Bus.
- CLK / CMD: Control Signals.
- VCC: 3.3V (Power for the NAND Flash).
- VCCQ: 1.8V or 3.3V (Power for the Interface/Controller). Tip: Using 1.8V for VCCQ allows for higher HS400 speeds.
5. Sourcing & Replacements
Is 4GB Enough? For Windows IoT or Android 12+, 4GB is tight. However, for Yocto Linux, Ubuntu Core, or RTOS, 4GB is plenty.
Replacements / Upgrades: If the KLM4G1FETE-B041 is out of stock, or you need more space, you can typically drop in the 8GB version on the same PCB pad:
- Upgrade: KLM8G1GETF-B041 (8GB eMMC 5.1).
- Cross-Reference: Compatible parts from Kioxia (Toshiba) or Micron also exist, but check the "Extended CSD" register settings if your bootloader is picky.
6. Conclusion
The Samsung KLM4G1FETE-B041 is a robust, high-endurance storage workhorse. It bridges the gap between raw NAND (hard to manage) and full SSDs (too expensive/large). For any application requiring reliable, soldered-down storage in the 4GB range, this MLC-based eMMC 5.1 chip remains the gold standard.
Sourcing Samsung eMMC? Need verified stock for your production run? Visit Aichiplink.com to search for KLM4G1FETE-B041 and other embedded storage solutions.
Written by Jack Elliott from AIChipLink.
AIChipLink, one of the fastest-growing global independent electronic components distributors in the world, offers millions of products from thousands of manufacturers, and many of our in-stock parts is available to ship same day.
We mainly source and distribute integrated circuit (IC) products of brands such as Broadcom, Microchip, Texas Instruments, Infineon, NXP, Analog Devices, Qualcomm, Intel, etc., which are widely used in communication & network, telecom, industrial control, new energy and automotive electronics.
Empowered by AI, Linked to the Future. Get started on AIChipLink.com and submit your RFQ online today!
Frequently Asked Questions
Q1: What type of storage is KLM4G1FETE-B041?
It is a 4GB eMMC 5.1 storage chip with an integrated controller, designed for embedded systems.
Q2: Is KLM4G1FETE-B041 suitable for industrial applications?
Yes. It uses MLC NAND, offering higher endurance and better reliability than TLC-based eMMC.
Q3: What interface speed does eMMC 5.1 support on this chip?
It supports HS400 mode, with interface speeds up to 400 MB/s.
Q4: What package does KLM4G1FETE-B041 use?
The chip comes in a 153-ball FBGA package, compliant with JEDEC standards.
Q5: Can KLM4G1FETE-B041 be replaced with a higher-capacity eMMC?
Yes. In most designs, it can be replaced with compatible 8GB or larger Samsung eMMC 5.1 parts using the same footprint.
