Product Quick Card
╔══════════════════════════════════════════════════════╗
║ PEX8619-BA50BC - At a Glance ║
╠══════════════════════════════════════════════════════╣
║ Manufacturer: Broadcom (formerly PLX Technology) ║
║ Function: PCIe Packet Switch ║
║ PCIe Gen: Gen 2 (5.0 GT/s per lane) ║
║ Total Lanes: 16 lanes (configurable) ║
║ Ports: 3 upstream + 3 downstream max ║
║ Max Stations: 16 virtual endpoints ║
║ Non-Transparent: Yes (NT mode supported) ║
║ Package: 456-ball FCBGA (23×23mm) ║
║ Temperature: 0°C to +100°C (commercial) ║
║ Voltage: 1.0V core, 1.5V/3.3V I/O ║
║ Status: Mature product (active) ║
╚══════════════════════════════════════════════════════╝
One-Line Summary: PEX8619 is a flexible 16-lane PCIe Gen2 switch enabling complex system topologies with transparent and non-transparent bridging for servers, storage, and embedded applications.
Part Number Decoder
P E X 8 6 1 9 - B A 5 0 B C
│ │ │ │ │ │ │ │ │ │ │ │ └─ C = RoHS 6/6 compliant
│ │ │ │ │ │ │ │ │ │ │ └─── B = Package type (FCBGA)
│ │ │ │ │ │ │ │ │ │ └───── 0 = Reserved
│ │ │ │ │ │ │ │ │ └─────── 5 = Speed grade/revision
│ │ │ │ │ │ │ │ └───────── A = Configuration
│ │ │ │ │ │ │ └─────────── B = Process/die variant
│ │ │ │ │ │ └─────────────── - (Separator)
│ │ │ │ │ └───────────────── 9 = Port configuration
│ │ │ │ └─────────────────── 1 = Feature set
│ │ │ └───────────────────── 6 = Port count indicator
│ │ └─────────────────────── 8 = Product family (86xx series)
│ └───────────────────────── X = Express (PCIe)
└─────────────────────────── PE = PCI Express
Result: 16-lane PCIe Gen2 switch, FCBGA package, RoHS compliant
Architecture Overview
Lane Distribution
Total Available: 16 PCIe Gen2 lanes (5.0 GT/s each)
Configurable as:
┌────────────────────────────────────────┐
│ Option 1: 2 ports │
│ Port 0: ×8 or ×16 (upstream) │
│ Port 1: ×8 or ×16 (downstream) │
└────────────────────────────────────────┘
┌────────────────────────────────────────┐
│ Option 2: 4 ports │
│ Port 0: ×8 (upstream) │
│ Port 1: ×4 (downstream) │
│ Port 2: ×2 (downstream) │
│ Port 3: ×2 (downstream) │
└────────────────────────────────────────┘
┌────────────────────────────────────────┐
│ Option 3: 6 ports (maximum flexibility)│
│ Upstream: 1-3 ports │
│ Downstream: 1-5 ports │
│ Mix: ×1, ×2, ×4, ×8 widths │
└────────────────────────────────────────┘
Configuration via strapping pins or I2C EEPROM
Block Diagram
┌─────────────────────────────────────────────────────┐
│ PEX8619-BA50BC │
├─────────────────────────────────────────────────────┤
│ │
│ ┌──────────────────────────────────────────┐ │
│ │ 16-Lane PCIe Gen2 Core │ │
│ │ (5.0 GT/s per lane) │ │
│ └────────────┬─────────────────────────────┘ │
│ │ │
│ ┌────────────▼─────────────────────────────┐ │
│ │ Packet Switching Fabric │ │
│ │ - Cut-through switching │ │
│ │ - Store-and-forward mode │ │
│ │ - Quality of Service (QoS) │ │
│ └────┬────┬────┬────┬────┬────┬────────────┘ │
│ │ │ │ │ │ │ │
│ ┌────▼┐ ┌─▼──┐ ┌▼──┐ ┌▼──┐ ┌▼──┐ ┌▼──┐ │
│ │Port0│ │Port1│ │Port2│ │Port3│ │Port4│ │Port5│ │
│ │ ×16 │ │ ×8 │ │ ×4 │ │ ×2 │ │ ×2 │ │ ×2 │ │
│ └──┬──┘ └──┬──┘ └─┬──┘ └─┬──┘ └─┬──┘ └─┬──┘ │
│ │ │ │ │ │ │ │
│ ┌──▼───────▼──────▼──────▼──────▼──────▼───┐ │
│ │ SerDes (Serializer/Deserializer) │ │
│ │ 16 differential pairs (TX/RX) │ │
│ └────────────────────────────────────────┬─┘ │
│ │ │
│ ┌─────────────────────────────────────┐ │ │
│ │ Configuration & Control │ │ │
│ │ - I2C/SMBus interface │ │ │
│ │ - EEPROM interface │ │ │
│ │ - GPIO pins │ │ │
│ │ - JTAG boundary scan │ │ │
│ └─────────────────────────────────────┘ │ │
│ │ │
│ ┌─────────────────────────────────────┐ │ │
│ │ Non-Transparent Bridge (optional) │ │ │
│ │ - Address translation │ │ │
│ │ - DMA engines │ │ │
│ └─────────────────────────────────────┘ │ │
└───────────────────────────────────────────┼───────┘
│
PCIe Gen2 Interface
(to external devices)
Technical Specifications
PCIe Interface Specifications
Link Speeds:
PCIe Gen2:
- Per lane: 5.0 GT/s (Gigatransfers/sec)
- Encoding: 8b/10b
- Effective bandwidth: 4.0 Gb/s per lane (500 MB/s)
Maximum Throughput:
×1 lane: 500 MB/s (4 Gb/s)
×2 lanes: 1000 MB/s (8 Gb/s)
×4 lanes: 2000 MB/s (16 Gb/s)
×8 lanes: 4000 MB/s (32 Gb/s)
×16 lanes: 8000 MB/s (64 Gb/s)
Bidirectional: Full-duplex (same speed TX and RX)
Link Features:
✅ Auto-negotiation (link width and speed)
✅ Lane reversal support
✅ Polarity inversion
✅ Spread spectrum clocking (SSC)
✅ Active State Power Management (ASPM)
✅ Clock gating for power savings
✅ Hot-plug support
Electrical Specifications
Power Supply Requirements:
VDDC (Core):
- Voltage: 1.0V ± 5%
- Current: 3-5A typical (depends on config)
- Ripple: <50 mV p-p
VDDA (Analog):
- Voltage: 1.0V ± 5%
- Current: 1-2A typical
- Ripple: <50 mV p-p
VDD18 (I/O):
- Voltage: 1.5V ± 5%
- Current: 0.5-1A
- For PCIe signaling
VDD33 (Aux):
- Voltage: 3.3V ± 5%
- Current: 0.2-0.5A
- For configuration and management
Total Power Consumption:
- Typical: 4-6W (all ports active)
- Maximum: 8W (worst case)
- Idle: 2W (with ASPM)
Power Sequencing:
Correct Power-On Sequence:
1. VDDC (1.0V core) → First
2. VDDA (1.0V analog) → 0-10 ms later
3. VDD18 (1.5V I/O) → 0-10 ms later
4. VDD33 (3.3V aux) → 0-10 ms later
5. Release PERST# → 10-100 ms after VDD33
Power-Off: Reverse order
Package Information
456-Ball FCBGA (Flip-Chip Ball Grid Array):
Dimensions:
- Body: 23mm × 23mm × 1.0mm
- Ball pitch: 1.0mm
- Total balls: 456 (24×19 array)
- Ball diameter: 0.5mm (nominal)
Thermal characteristics:
- θJA: 25°C/W (with airflow)
- θJC: 5°C/W (junction to case)
- TJ max: 100°C
PCB requirements:
- 8-layer minimum (10-12 layer recommended)
- Via-in-pad for signal routing
- Thermal vias for heat dissipation
Ball Map Overview:
Top View (456-ball FCBGA)
Ball A1 at top-left
A ●●●●●●●●●●●●●●●●●●●●●●●● (24 columns)
B ●●●●●●●●●●●●●●●●●●●●●●●●
C ●●●●●●●●●●●●●●●●●●●●●●●●
...
T ●●●●●●●●●●●●●●●●●●●●●●●● (19 rows)
Ball assignments:
- PCIe lanes: Differential pairs (TX+/TX-, RX+/RX-)
- Power/Ground: Distributed throughout
- Config/Control: Corner regions
- No connects: Various locations
Pin 1 (A1): Typically marked with dot or triangle
Port Configuration
Configuration Options
Strapping Pin Configuration:
CONFIG[3:0] pins determine port configuration:
CONFIG = 0000b: Mode 0
Port 0: ×16 upstream
Port 1: ×16 downstream (not available - shared lanes)
CONFIG = 0001b: Mode 1
Port 0: ×8 upstream
Port 1: ×8 downstream
CONFIG = 0010b: Mode 2
Port 0: ×4 upstream
Port 1: ×4 downstream
Port 2: ×4 downstream
Port 3: ×4 downstream
CONFIG = 0011b: Mode 3
Port 0: ×8 upstream
Port 1: ×4 downstream
Port 2: ×2 downstream
Port 3: ×2 downstream
(More modes available - see datasheet)
EEPROM Configuration:
Alternative: Load configuration from I2C EEPROM
- More flexible than strapping pins
- Can change without hardware modification
- Allows advanced features
EEPROM interface:
- I2C address: 0xA0 (default)
- Speed: 100 kHz or 400 kHz
- Size: 16 KB minimum
- Format: Proprietary binary structure
Non-Transparent (NT) Mode
What is Non-Transparent Bridging?
Transparent Mode (Normal):
Host CPU
↓
PCIe Switch (transparent)
↓
Devices appear in host's address space
All devices share same memory map
Use case: Typical PCIe expansion
Non-Transparent Mode:
System A System B
CPU CPU
↓ ↓
PCIe PCIe
↓ ↓
└─────[PEX8619 NT]─────┘
Two separate address spaces
Systems communicate via mailboxes and doorbell registers
Each system is isolated from the other
Use case: Multi-host systems, failover configurations
NT Bridge Features
Address Translation:
PEX8619 NT bridge provides:
- Lookup tables (LUTs) for address mapping
- 12 programmable address windows
- BAR (Base Address Register) mapping
- Support for 32-bit and 64-bit addressing
Example translation:
System A: 0x8000_0000 → NT LUT → System B: 0x4000_0000
Inter-System Communication:
Doorbell Registers:
- 16 doorbell interrupts per direction
- Trigger interrupts in remote system
- Use: Signal events, synchronization
Mailbox Registers:
- Shared memory regions
- Controlled access via NT bridge
- Use: Pass messages, small data
DMA Engines:
- 2 independent DMA channels
- Transfer data between systems
- Hardware-accelerated (no CPU overhead)
Application Examples
Application 1: Multi-GPU Server
Use Case:
High-performance computing server with 4 GPUs
PEX8619 provides PCIe connectivity
Configuration:
Port 0 (×16): CPU connection (upstream)
Port 1 (×4): GPU #1
Port 2 (×4): GPU #2
Port 3 (×4): GPU #3
Port 4 (×4): GPU #4
All GPUs accessible to CPU via transparent switching
Aggregate bandwidth: 16 GB/s (4×4 lanes × 500 MB/s/lane)
System Diagram:
CPU (×16 PCIe)
│
┌──────▼────────┐
│ PEX8619 │
│ Port 0 (×16) │
└─┬──┬──┬──┬────┘
│ │ │ │
×4 │ ×4│ ×4│ ×4│
┌─▼┐ ┌▼┐ ┌▼┐ ┌▼┐
│GPU│ │GPU│ │GPU│ │GPU│
│#1 │ │#2 │ │#3 │ │#4 │
└───┘ └──┘ └──┘ └──┘
Application 2: Storage Controller with Failover
Use Case:
Dual-controller storage system with failover
Each controller can access all drives
NT Mode Configuration:
Port 0 (×8): Controller A
Port 1 (×8): Controller B (via NT bridge)
Ports 2-5 (×4 each): SAS/SATA controllers
Normal operation: Controller A is primary
Failover: Controller B takes over via NT access
Failover Mechanism:
Controller A Active:
A directly accesses drives
B monitors via doorbell registers
Controller A Fails:
B detects failure (timeout)
B takes ownership via NT bridge
B accesses drives directly
A isolated until recovered
Application 3: Embedded Vision System
Use Case:
Multi-camera vision processing system
4 cameras, each with dedicated PCIe capture card
Central processor analyzes video
Configuration:
Port 0 (×8): Host processor
Port 1 (×2): Camera 1 (×2)
Port 2 (×2): Camera 2 (×2)
Port 3 (×2): Camera 3 (×2)
Port 4 (×2): Camera 4 (×2)
All camera streams converge to processor
Real-time video processing
Design Guidelines
Power Supply Design
Voltage Regulator Selection:
VDDC (1.0V, 3-5A):
→ Switching regulator recommended
→ Example: TPS53355 (buck converter)
→ Output capacitors: 4× 100µF + 10× 10µF ceramic
VDDA (1.0V, 1-2A):
→ Low-noise LDO preferred (analog sensitive)
→ Example: TPS74801 (1A LDO)
→ Filter input from VDDC
→ Output capacitors: 2× 47µF + 4× 10µF
VDD18 (1.5V, 0.5-1A):
→ Switching or LDO
→ Must be clean for PCIe signaling
VDD33 (3.3V, 0.2-0.5A):
→ LDO from 5V system rail
→ Dedicated for management circuits
Decoupling Strategy:
Critical: Aggressive decoupling for each power rail
VDDC (1.0V core):
- Bulk: 4× 100µF (low ESR)
- Medium: 20× 10µF (0805)
- High-freq: 40× 0.1µF (0402)
- Ultra-high: 20× 0.01µF (0201)
Placement:
- 0.1µF and 0.01µF within 5mm of each power ball
- Distributed across entire IC footprint
- Via-in-pad for lowest inductance
PCB Design Guidelines
Layer Stackup (12-layer recommended):
Layer 1: Top signals (PCIe, high-speed)
Layer 2: Ground plane (solid)
Layer 3: Signal routing
Layer 4: Power plane (VDDC, VDDA)
Layer 5: Signal routing
Layer 6: Ground plane (solid)
Layer 7: Ground plane (solid)
Layer 8: Signal routing
Layer 9: Power plane (VDD18, VDD33)
Layer 10: Signal routing
Layer 11: Ground plane (solid)
Layer 12: Bottom signals
Key: Multiple ground planes reduce return path inductance
PCIe Differential Pair Routing:
Impedance: 100Ω differential ± 10%
Intrapair skew: <5 ps (< 0.7 mm)
Via count: Minimize (each via = ~1-2 ps)
Length matching: ±5 mils within pair
Trace parameters (typical):
Width: 5 mil (0.127 mm)
Spacing: 5 mil (trace to trace)
Gap: 8 mil (between pairs)
Copper: 1 oz (35 µm)
Dielectric: FR-4 (εr = 4.2-4.5)
Reference Clock Distribution:
100 MHz reference clock to each port:
- Source: Crystal oscillator or LVDS buffer
- Topology: Point-to-point or clock tree
- Impedance: 100Ω differential
- Jitter: <20 ps RMS
- Spread spectrum: Optional (±0.5% @ 30-33 kHz)
Clock routing:
- Shortest path from source
- Equal length to all ports (±10 mils)
- Avoid vias if possible
- No stubs
Thermal Management
Heat Dissipation Strategies:
Package TJ max: 100°C
Ambient: 50°C (typical server environment)
Power dissipation: 6W typical
Thermal budget: 100°C - 50°C = 50°C
Required θJA: 50°C / 6W = 8.3°C/W
Achieving 8.3°C/W:
✅ Heatsink: 20×20mm, 10mm height
✅ Thermal interface: TIM pad or paste
✅ Airflow: 200 LFM minimum
✅ PCB: Thermal vias under package (array)
✅ Copper area: Large GND pour on bottom
Thermal Via Array:
Under FCBGA package:
- Via size: 0.3mm diameter
- Via pitch: 1.0mm (aligned with balls)
- Via count: 100+ thermal vias
- Filled: Copper-filled preferred
- Connection: Direct to GND plane
Purpose: Transfer heat from package to PCB
Effectiveness: Can reduce θJA by 10-15°C/W
Configuration & Initialization
Boot Process
Power-On Sequence:
1. Apply power rails (correct sequence)
2. Wait 10-100 ms for voltage stabilization
3. Release PERST# (PCIe reset)
4. PEX8619 reads configuration:
- Check strapping pins
- Or load from I2C EEPROM
5. Initialize SerDes (PHY layer)
6. Begin link training on all ports
7. Enumerate devices (if transparent mode)
8. System ready for operation
Total boot time: ~300-500 ms
Configuration Sources
Priority Order:
1. I2C EEPROM (if present and valid)
- Highest priority
- Most flexible
- Can override strapping pins
2. Strapping pins
- Sampled at reset
- Fixed configuration
- Simpler for basic setups
3. Software configuration (via PCIe)
- After boot
- Runtime changes
- Limited scope
Management Interface
I2C/SMBus Access:
Purpose: Runtime configuration and monitoring
Slave address: 0xD0 (default, configurable)
Speed: 100 kHz or 400 kHz
Registers: 0x0000 to 0xFFFF (64KB space)
Common operations:
- Read temperature sensors
- Monitor link status
- Change port configurations
- Read error counters
- Trigger reset
Troubleshooting Guide
Problem: Link Training Fails
Diagnostic Steps:
1. Check reference clock
- Verify 100 MHz present at all ports
- Measure with oscilloscope
- Check frequency and jitter
2. Verify power rails
- VDDC: 1.0V ± 5%
- VDD18: 1.5V ± 5%
- Ripple <50 mV
3. Check PERST# signal
- Must be asserted (LOW) during power-up
- Release (HIGH) after power stable
- Hold time: >100 ms after VDD stable
4. Inspect PCIe traces
- No visible damage
- Continuity test TX/RX pairs
- Check for shorts/opens
5. Verify configuration
- Strapping pins correct?
- EEPROM present and valid?
- Port configuration matches hardware?
Problem: Link Speed Lower Than Expected
Common Causes:
Issue: Link trains at ×1 instead of ×8
Causes:
- 7 lanes have errors (only 1 good)
- Signal integrity problem
- Improper impedance matching
- Excessive crosstalk
Debug:
1. Check which lanes failed
→ Read lane status registers via I2C
2. Inspect PCB layout for failing lanes
3. Measure eye diagram (if equipment available)
4. Verify termination resistors
Problem: High Error Rate
Performance Monitoring:
Check error counters via I2C:
- Receiver errors (CRC, framing)
- Symbol errors (8b/10b decode)
- Training errors
Acceptable rates:
< 1 error per 10^12 bits = Good ✅
> 1 error per 10^9 bits = Problem ❌
If high error rate:
1. Check signal integrity (eye diagram)
2. Verify power supply noise (<50 mV ripple)
3. Inspect for EMI sources
4. Review PCB layout (crosstalk?)
5. Consider temperature (within 0-100°C?)
Alternative Parts & Cross-Reference
Broadcom PCIe Switch Family
Higher Port Count:
PEX8724: 24-lane PCIe Gen2 switch
PEX8732: 32-lane PCIe Gen3 switch
PEX8748: 48-lane PCIe Gen3 switch
More lanes = more flexibility
Gen3 = 8 GT/s (2× speed)
Lower Port Count:
PEX8608: 8-lane PCIe Gen2 switch
PEX8612: 12-lane PCIe Gen2 switch
For smaller systems
Lower cost
Lower power
Competitors
Microchip (formerly Microsemi):
Switchtec PFX PCIe switches
PSX series (Gen3/Gen4)
Diodes Incorporated (acquired Pericom):
PI7C9X series PCIe switches
Note: PEX8619 is mature, proven design Widely used in existing systems Replacement parts available
---
## Real-World Applications
**Known Uses:**
Server Systems:
- Dell PowerEdge servers (PCIe expansion)
- HP ProLiant servers (I/O modules)
- Supermicro motherboards
Storage Systems:
- NetApp FAS systems
- EMC storage arrays
- SAN controllers
Industrial/Embedded:
- Advantech industrial computers
- Kontron COM Express modules
- Medical imaging equipment
Note: Specific models may vary PEX8619 family widely deployed
---
## Summary & Design Checklist
### Quick Reference
Key Specs:
- 16 lanes PCIe Gen2 (5.0 GT/s)
- 3-6 configurable ports
- NT bridge support
- 456-ball FCBGA
- 4-6W typical power
Strengths: ✅ Flexible port configuration ✅ Non-transparent mode ✅ Mature, proven design ✅ Good software support ✅ Available from distribution
### Design Checklist
Power Supply: ☑ All rails within ±5% tolerance ☑ Proper sequencing implemented ☑ Adequate decoupling (100+ caps) ☑ Low-noise LDO for VDDA
PCB Design: ☑ 10-12 layer stackup ☑ 100Ω differential impedance ☑ Via-in-pad for BGA routing ☑ Thermal vias under package (100+) ☑ Reference clock routed properly
Configuration: ☑ Strapping pins set correctly ☑ Or EEPROM programmed ☑ I2C address configured ☑ GPIO functions assigned
Thermal: ☑ Heatsink sized for 6W ☑ Airflow >200 LFM ☑ Junction temp <85°C typical
Testing: ☑ Link training successful ☑ Error rate <10^-12 ☑ Bandwidth meets requirements ☑ NT bridge tested (if used)
---
## Conclusion
The **PEX8619-BA50BC is a versatile PCIe Gen2 switch** offering 16 lanes of connectivity in flexible configurations for server, storage, and embedded applications. Its support for non-transparent bridging enables advanced multi-host architectures, while transparent mode handles typical PCIe expansion seamlessly.
**Successful implementation requires**:
- Careful power supply design with clean, sequenced rails
- High-quality PCB layout with controlled impedance
- Proper thermal management for 4-6W dissipation
- Correct configuration via strapping or EEPROM
**Despite being Gen2 technology**, the PEX8619 remains relevant in 2026 for applications where proven reliability and broad software support outweigh the need for Gen3/Gen4 speeds.
**For detailed datasheets, reference designs, and PCIe system architecture guidance, visit [AiChipLink.com](https://aichiplink.com).**
> **[Search PEX8619-BA50BC Stock Now](https://aichiplink.com/product-detail/PEX8619-BA50BCG-BROADCOM_15327351)**
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Frequently Asked Questions
What is the PEX8619-BA50BC used for?
The PEX8619-BA50BC is a 16-lane PCIe Gen2 switch used to expand a single PCIe interface into multiple downstream connections, enabling complex system architectures such as multi-GPU servers, storage controllers, and embedded systems requiring high-speed interconnect and flexible lane distribution.
Does PEX8619 support non-transparent bridging (NT mode)?
Yes, the PEX8619 supports non-transparent (NT) bridging, allowing two independent host systems to communicate while maintaining separate memory spaces, which is essential for applications like dual-controller storage, failover systems, and high-availability architectures.
What is the maximum bandwidth of PEX8619?
The PEX8619 operates at PCIe Gen2 speeds of 5.0 GT/s per lane, delivering up to 500 MB/s per lane, which means a fully utilized ×16 configuration can achieve up to 8 GB/s of aggregate bandwidth in each direction under ideal conditions.
How is the PEX8619 configured in a system?
The device can be configured using hardware strapping pins for fixed setups or through an external I2C EEPROM for more flexible configurations, allowing designers to define port widths, lane assignments, and advanced features without redesigning the hardware.
What are the key design challenges when using PEX8619?
The main challenges include ensuring clean and properly sequenced power rails, maintaining strict PCB layout requirements for high-speed PCIe differential pairs, managing thermal dissipation for a 4–6W device, and guaranteeing signal integrity to avoid link training failures or reduced bandwidth.
