AMD XC6SLX9-3CSG324I
Manufacturer No:
XC6SLX9-3CSG324I
Manufacturer:
AMD
Package:
324-LFBGA, CSPBGA
Description:
1.2V V FPGAs Spartan®-6 LX Series 324-LFBGA, CSPBGA
Quantity:
In Stock :5241
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Expected Shipping：Mon, Jun 1 - Tue, Jun 2, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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XC6SLX9-3CSG324I Information
AMD XC6SLX9-3CSG324I technical specifications, attributes, parameters and parts with similar specifications to AMD XC6SLX9-3CSG324I.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 324-LFBGA, CSPBGA
- Number of Pins
- 324
- Supplier Device Package
- 324-CSPBGA (15x15)
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Spartan®-6 LX
- Published
- 2008
- Type
- Parameter
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Max Operating Temperature
- 100°C
- Min Operating Temperature
- -40°C
- Voltage - Supply
- 1.14V~1.26V
- Base Part Number
- XC6SLX9
- Operating Supply Voltage
- 1.2V
- Number of I/O
- 200
- RAM Size
- 72kB
- Number of Logic Elements/Cells
- 9152
Download datasheets and manufacturer documentation for AMD XC6SLX9-3CSG324I.
Datasheets:
Environmental Information:
XC6SLX9-3CSG324I Overview
The package that contains this software is called 324-LFBGA, CSPBGA. There are 200 I/Os for better data transfer. In order to construct a fundamental building block, 9152 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~1.26V battery. There are many types of FPGAs in the Spartan®-6 LX series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 589824. If you are looking for related parts, you can use the base part number XC6SLX9 as a starting point. For the program to work properly, the RAM si72kBe of this FPGA module must reach 72kB GB in order to ensure normal operation. In this case, 324 pins are used in the design. 715 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. When this module is operated at its maximum operating temperature, it reaches 100°C. A higher operating temperature than -40°C is recommended. There are 715 logic blocks (LABs) in the system, which form its basic building blocks. In order to store and transfer data, a total of 11440 registers are used. The supplier of the device package is 324-CSPBGA (15x15).
XC6SLX9-3CSG324I Features
200 I/Os
Up to 589824 RAM bits
324 LABs/CLBs
100°C gates
715 logic blocks (LABs)
11440 registers
XC6SLX9-3CSG324I Applications
There are a lot of Xilinx Inc.
XC6SLX9-3CSG324I FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
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