AMD XCR3384XL-12FG324I

Manufacturer No:

XCR3384XL-12FG324I

Manufacturer:

AMD

Package:

FBGA

Description:

1mm PMIC 324 Pin 3.3V FBGA

Quantity:

Delivery:

Payment:

In Stock :Available

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XCR3384XL-12FG324I information

AMD XCR3384XL-12FG324I technical specifications, attributes, parameters and parts with similar specifications to AMD XCR3384XL-12FG324I.

Type
Parameter

Mount
Surface Mount

Package / Case
FBGA

Number of Pins
324

Packaging
Bulk

JESD-609 Code
e0

Pbfree Code
no

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
324

ECCN Code
3A991.D

Terminal Finish
Tin/Lead (Sn63Pb37)

Max Operating Temperature
85°C

Min Operating Temperature
-40°C

Additional Feature
YES

HTS Code
8542.39.00.01

Subcategory
Programmable Logic Devices

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
225

Supply Voltage
3.3V

Terminal Pitch
1mm

Reach Compliance Code
not_compliant

Time@Peak Reflow Temperature-Max (s)
30

Pin Count
324

Operating Supply Voltage
3.3V

Supply Voltage-Max (Vsup)
3.6V

Temperature Grade
INDUSTRIAL

Number of I/O
220

Memory Type
EEPROM

Propagation Delay
12 ns

Frequency (Max)
83MHz

Programmable Logic Type
EE PLD

Number of Gates
9000

Number of Logic Blocks (LABs)
24

Speed Grade
12

Output Function
MACROCELL

Number of Macro Cells
384

JTAG BST
YES

In-System Programmable
YES

Length
23mm

Height Seated (Max)
2.5mm

Width
23mm

RoHS Status
RoHS Compliant

Lead Free
Contains Lead

Download datasheets and manufacturer documentation for AMD XCR3384XL-12FG324I.

XCR3384XL-12FG324I Overview

In the mobile phone network, there are 384macro cells, which are cells with high-power antennas and towers.The item is packaged with FBGA.As you can see, this device has 220 I/O ports programmed into it.There is a 324 terminations set on devices.This electrical part is wired with a terminal position of BOTTOM.There is 3.3V voltage supply for this device.This part is in the family Programmable Logic Devices.Bulk should be used for packaging the chip.There are 324 pins on the chip.Additionally, this device is capable of displaying YES.A digital circuit is built using 9000 gates.In order to maintain high efficiency, the supply voltage should be maintained at 3.3V.For storing data, it is recommended to use EEPROM.This device is mounted by Surface Mount.There are 324 pins embedded in the device.A maximum supply voltage (Vsup) of 3.6V is provided.In order to operate properly, the operating temperature should be higher than -40°C.It is recommended to keep the operating temperature below 85°C.In total, it contains 24 logic blocks (LABs).It is recommended that the maximal frequency be less than 83MHz.A programmable logic type is classified as EE PLD.

XCR3384XL-12FG324I Features

FBGA package
220 I/Os
324 pin count
324 pins
24 logic blocks (LABs)

XCR3384XL-12FG324I Applications

There are a lot of Xilinx
XCR3384XL-12FG324I CPLDs applications.

Power up sequencing
Voltage level translation
Timing control
Interface bridging
I/O expansion
Discrete logic functions
Bootloaders for FPGAs
Address decoders
Custom state machines
Digital systems

User Guide

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