AMD XC3S5000-4FGG900C
Manufacturer No:
XC3S5000-4FGG900C
Manufacturer:
Package:
900-BBGA
Description:
1.2V V 2.6mm mm FPGAs Spartan®-3 Series 900-BBGA 1mm mm 900
Quantity:
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XC3S5000-4FGG900C Information
AMD XC3S5000-4FGG900C technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S5000-4FGG900C.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 900-BBGA
- Number of Pins
- 900
- Number of I/Os
- 633
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Spartan®-3
- Published
- 2009
- Type
- Parameter
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 900
- ECCN Code
- 3A991.D
- Voltage - Supply
- 1.14V~1.26V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 250
Download datasheets and manufacturer documentation for AMD XC3S5000-4FGG900C.
Datasheets:
Environmental Information:
Product Description:
The XC3S5000-4FGG900C is a high-performance, field-programmable gate array (FPGA) from Xilinx Inc. This device is part of the Spartan-3 series, offering a unique combination of speed, density, and I/O capacity. With a clock frequency of 630MHz, this FPGA is designed to handle demanding applications requiring high-speed data processing and manipulation.
Features:
- High-speed operation with a clock frequency of 630MHz
- 5 million gates and 74880 logic elements/cells for dense programmable logic
- 633 I/O pins and 900 terminations for extensive connectivity
- 234kB RAM for data storage and processing
- Operating temperature range of 0°C to 85°C TJ
- Surface-mount packaging with a 900-BBGA package and tray packaging
- Pb-free and RoHS3 compliant for environmental sustainability
- Operating supply voltage of 1.2V and multiple power supply options
Applications:
- High-speed data processing and manipulation in applications such as:
- Telecommunications
- Data storage and retrieval
- Image and video processing
- Industrial automation and control
- Secondary applications include:
- Medical devices
- Aerospace and defense systems
- Automotive systems
Alternative Parts:
- XC3S5000-4FGG900C is an active part with no alternative parts listed.
Embedded Modules:
- This FPGA is used in various embedded modules, including:
- Xilinx Spartan-3 FPGA modules
- Custom-designed FPGA modules for specific applications
FAQs:
Q: What is the maximum combinational delay of a CLB-Max? A: The maximum combinational delay of a CLB-Max is 0.61 ns.
Q: What is the operating temperature range of this FPGA? A: The operating temperature range is 0°C to 85°C TJ.
Q: Is this FPGA Pb-free and RoHS3 compliant? A: Yes, the XC3S5000-4FGG900C is Pb-free and RoHS3 compliant.
Q: What is the maximum peak reflow temperature? A: The maximum peak reflow temperature is 250°C.
Q: What is the factory lead time for this part? A: The factory lead time is 10 weeks.
Q: Is this part qualified? A: No, the part is not qualified.
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