AMD XC2S100E-6FTG256C
AMD XC2S100E-6FTG256C

AMD XC2S100E-6FTG256C

Manufacturer No:

XC2S100E-6FTG256C

Manufacturer:

AMD

Package:

256-LBGA

Description:

1.8V V 2mm mm FPGAs Spartan®-IIE Series 256-LBGA 1mm mm 256

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XC2S100E-6FTG256C information

AMD XC2S100E-6FTG256C technical specifications, attributes, parameters and parts with similar specifications to AMD XC2S100E-6FTG256C.

  • Type
  • Parameter
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 256-LBGA
  • Number of Pins
  • 256
  • Operating Temperature
  • 0°C~85°C TJ
  • Packaging
  • Tray
  • Series
  • Spartan®-IIE
  • Published
  • 2008
  • JESD-609 Code
  • e1
  • Pbfree Code
  • yes
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 256
  • ECCN Code
  • EAR99
  • Terminal Finish
  • Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • HTS Code
  • 8542.39.00.01
  • Subcategory
  • Field Programmable Gate Arrays
  • Technology
  • CMOS
  • Voltage - Supply
  • 1.71V~1.89V
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 260
  • Supply Voltage
  • 1.8V
  • Terminal Pitch
  • 1mm
  • Base Part Number
  • XC2S100E
  • Pin Count
  • 256
  • Number of Outputs
  • 202
  • Operating Supply Voltage
  • 1.8V
  • Number of I/O
  • 182
  • RAM Size
  • 5kB
  • Clock Frequency
  • 357MHz
  • Programmable Logic Type
  • FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
  • 2700
  • Total RAM Bits
  • 40960
  • Number of Gates
  • 100000
  • Number of LABs/CLBs
  • 600
  • Speed Grade
  • 6
  • Combinatorial Delay of a CLB-Max
  • 0.47 ns
  • Number of CLBs
  • 600
  • Number of Equivalent Gates
  • 37000
  • Length
  • 17mm
  • Height Seated (Max)
  • 2mm
  • Width
  • 17mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Lead Free

Download datasheets and manufacturer documentation for AMD XC2S100E-6FTG256C.

XC2S100E-6FTG256C Overview


Fpga chips is supplied in the 256-LBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 182 I/Os for transferring data in a more coherent manner. There are 2700 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.8V. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.71V~1.89V. It is a type of FPGA belonging to the Spartan®-IIE seies. The operating temperature should be kept at 0°C~85°C TJ when operating. There are 202 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. Fpga chips is designed wFpga chipsh 256 terminations. The RAM bits that this device offer is 40960. Its base part number XC2S100E can be used to find related parts. The RAM si5kBe of this FPGA module reaches 5kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 256 pins. This FPGA is built as an array of 600 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.8V, designers can fully make use of its flexibility. Its basic building block contains 100000 gates. Fpga semiconductor is equipped wfpga semiconductorh 256 pin count. Typically, fpga semiconductor uses a crystal oscillating at 357MHz . 600 CLBs are basic modules used for its architecture. 37000 equivalent gates are used for the design implement in the FPGA.

XC2S100E-6FTG256C Features


182 I/Os
Up to 40960 RAM bits
256 LABs/CLBs


XC2S100E-6FTG256C Applications


There are a lot of Xilinx Inc.
XC2S100E-6FTG256C FPGAs applications.


  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition

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