AMD XC17512LPD8C
Manufacturer No:
XC17512LPD8C
Manufacturer:
Package:
8-DIP (0.300, 7.62mm)
Description:
Through Hole 512kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17512L not_compliant
Quantity:
Delivery:
Payment:
In Stock :Available
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XC17512LPD8C information
AMD XC17512LPD8C technical specifications, attributes, parameters and parts with similar specifications to AMD XC17512LPD8C.
- Type
- Parameter
- Mounting Type
- Through Hole
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Surface Mount
- NO
- Number of Pins
- 8
- Operating Temperature
- 0°C~70°C
- Packaging
- Tube
- Published
- 2000
- JESD-609 Code
- e0
- Pbfree Code
- no
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- Not Applicable
- Number of Terminations
- 8
- ECCN Code
- EAR99
- Additional Feature
- USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
- Technology
- CMOS
- Voltage - Supply
- 3V~3.6V
- Terminal Position
- DUAL
- Peak Reflow Temperature (Cel)
- 225
- Number of Functions
- 1
- Supply Voltage
- 3.3V
- Terminal Pitch
- 2.54mm
- Reach Compliance Code
- not_compliant
- Time@Peak Reflow Temperature-Max (s)
- 30
- Base Part Number
- XC17512L
- Qualification Status
- Not Qualified
- Supply Voltage-Max (Vsup)
- 3.6V
- Power Supplies
- 3.3V
- Supply Voltage-Min (Vsup)
- 3V
- Programmable Type
- OTP
- Memory Size
- 512kb
- Operating Mode
- SYNCHRONOUS
- Clock Frequency
- 15MHz
- Supply Current-Max
- 0.005mA
- Organization
- 512KX1
- Output Characteristics
- 3-STATE
- Memory Width
- 1
- Standby Current-Max
- 0.00005A
- Parallel/Serial
- SERIAL
- I/O Type
- COMMON
- Memory IC Type
- CONFIGURATION MEMORY
- Length
- 9.3599mm
- Height Seated (Max)
- 4.5974mm
- Width
- 7.62mm
- RoHS Status
- RoHS Compliant
- Lead Free
- Contains Lead
Download datasheets and manufacturer documentation for AMD XC17512LPD8C.
XC17512LPD8C Overview
A neat 8-DIP (0.300, 7.62mm) package is used.Packaging for external use.A qualified individual who has the ability to operate within 0°C~70°C.Using OTP, you can program it.A voltage of 3V~3.6V is applied to it.The memory device is mounted in Through Hole.Data storage is limited to 512kb bytes.Other related parts can be found by searching "XC17512L".3.3V is the required supply voltage.Different functions are associated with 8 terminations.A maximum voltage of 3.6V can be applied to this memory device.It is necessary to supply the device with a minimum voltage of 3V.A CONFIGURATION MEMORY memory chip is shown here.FPGA is recommended that the reflow soldering temperature be maintained at no more than 225 during the process.8 pins are present.In this memory, data is transmitted using the SERIAL process.Memory chips can operate at a voltage no higher than 0.005mA.Parts come with 8 pins set.In terms of speed, this is a memory IC that operates at a 15MHz frequency.A COMMON configuration is used for the memory's I/O.3.3V power supplies are recommended.In order to better serve the needs, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included.
XC17512LPD8C Features
Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17512LPD8C Applications
There are a lot of Xilinx Inc.
XC17512LPD8C applications of configuration proms for FPGAs.
- cell phones
- eSRAM
- mainframes
- multimedia computers
- networking
- personal computers
- servers
- supercomputers
- telecommunications
- workstations,
User Guide
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Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
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XC17512LPD8C Relevant information
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