Hynix H5TQ1G63DFR-H9C

Manufacturer No:

H5TQ1G63DFR-H9C

Manufacturer:

Hynix

Package:

Description:

1.5 V V 96 Pin Memory IC 13 mm mm

Quantity:

Delivery:

Payment:

In Stock :Available

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H5TQ1G63DFR-H9C information

Hynix H5TQ1G63DFR-H9C technical specifications, attributes, parameters and parts with similar specifications to Hynix H5TQ1G63DFR-H9C.

Type
Parameter

Surface Mount
YES

Number of Terminals
96

Package Description
TFBGA, BGA96,9X16,32

Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH

Number of Words Code
64000000

Package Body Material
PLASTIC/EPOXY

Package Equivalence Code
BGA96,9X16,32

Reflow Temperature-Max (s)
20

Operating Temperature-Max
85 °C

RoHS Status
RoHS Compliant

Manufacturer Part Number
H5TQ1G63DFR-H9C

Clock Frequency-Max (fCLK)
667 MHz

Number of Words
67108864 words

Supply Voltage-Nom (Vsup)
1.5 V

Package Code
TFBGA

Package Shape
RECTANGULAR

Manufacturer
SK Hynix Inc

Part Life Cycle Code
Obsolete

Ihs Manufacturer
SK HYNIX INC

Risk Rank
5.79

Part Package Code
BGA

JESD-609 Code
e1

ECCN Code
EAR99

Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)

HTS Code
8542.32.00.32

Subcategory
DRAMs

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
260

Number of Functions
1

Terminal Pitch
0.8 mm

Reach Compliance Code
unknown

Pin Count
96

JESD-30 Code
R-PBGA-B96

Qualification Status
Not Qualified

Supply Voltage-Max (Vsup)
1.575 V

Power Supplies
1.5 V

Temperature Grade
OTHER

Supply Voltage-Min (Vsup)
1.425 V

Number of Ports
1

Operating Mode
SYNCHRONOUS

Supply Current-Max
0.2 mA

Organization
64MX16

Output Characteristics
3-STATE

Seated Height-Max
1.2 mm

Memory Width
16

Download datasheets and manufacturer documentation for Hynix H5TQ1G63DFR-H9C.

Product Description:

The H5TQ1G63DFR-H9C is a high-performance, 64Mx16 DDR DRAM (Double Data Rate Dynamic Random Access Memory) integrated circuit (IC) manufactured by Hynix. This IC is designed to provide high-speed data storage and retrieval capabilities for a wide range of applications.

Features:

64Mx16 memory density, providing a total of 67108864 words of storage
DDR DRAM technology, offering high-speed data transfer rates
Multi-bank page burst access mode, enabling fast data retrieval
Self-refresh and auto-refresh features for reduced power consumption
1.5V power supply voltage, making it suitable for a variety of applications
96-pin TFBGA (Thin Fine Pitch Ball Grid Array) package with a seated height of 1.2mm
Operating temperature range of -40°C to 85°C, making it suitable for use in a wide range of environments

Applications:

Primary applications: High-performance computing, gaming, and multimedia applications that require high-speed data storage and retrieval
Secondary applications: Industrial control systems, medical devices, and automotive systems that require reliable and efficient data storage

Alternative Parts:

Other DDR DRAM ICs from Hynix, such as the H5TQ1G63DFR-H9C
Other memory ICs from different manufacturers, such as Micron or Samsung

Embedded Modules:

This IC is commonly used in embedded systems, such as:
- Motherboards for desktop and laptop computers
- Graphics cards and other peripherals
- Industrial control systems and medical devices

Frequently Asked Questions:

Q: What is the maximum clock frequency of this IC? A: The maximum clock frequency is 667 MHz.

Q: What is the power consumption of this IC? A: The maximum power consumption is 0.2mA.

Q: Is this IC RoHS compliant? A: Yes, this IC is RoHS compliant.

Q: What is the package shape of this IC? A: The package shape is rectangular, with a TFBGA package code.

Q: What is the memory width of this IC? A: The memory width is 16 bits.

Q: Is this IC suitable for use in high-temperature environments? A: No, the operating temperature range is -40°C to 85°C, making it suitable for use in moderate-temperature environments.

User Guide

PURCHASE

Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.

MEANS OF PAYMENT

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.

RFQ (REQUEST FOR QUOTATIONS)

Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1：Prepare product

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step4：Individual Package

Step5：Anti-collision Filling

Step6：Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.