Hynix H5TQ4G63CFR-RDI
Manufacturer No:
H5TQ4G63CFR-RDI
Manufacturer:
Package:
Description:
DDR3 256MX16 FBGA96 I
Quantity:
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Step2：Desiccant Protection
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Step6：Packaging Box
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H5TQ4G63CFR-RDI Information
Hynix H5TQ4G63CFR-RDI technical specifications, attributes, parameters and parts with similar specifications to Hynix H5TQ4G63CFR-RDI.
- Type
- Parameter
- Surface Mount
- YES
- Number of Terminals
- 96
- Number of Words
- 268435456 words
- Package Shape
- RECTANGULAR
- Additional Feature
- AUTO/SELF REFRESH
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Number of Functions
- 1
- Terminal Pitch
- 0.8 mm
- Type
- Parameter
- Reach Compliance Code
- compliant
- JESD-30 Code
- R-PBGA-B96
- Supply Voltage-Max (Vsup)
- 1.575 V
- Temperature Grade
- INDUSTRIAL
- Supply Voltage-Min (Vsup)
- 1.425 V
- Number of Ports
- 1
- Operating Mode
- SYNCHRONOUS
- Organization
- 256MX16
- Seated Height-Max
- 1.2 mm
- Memory Width
- 16
Download datasheets and manufacturer documentation for Hynix H5TQ4G63CFR-RDI.
Product Description:
The H5TQ4G63CFR-RDI is a high-performance, industrial-grade DDR DRAM memory IC from Hynix, designed to meet the demands of modern computing systems. This 256Mx16-bit DDR DRAM is packaged in a TFBGA (Thin Fine Pitch Ball Grid Array) package, measuring 13mm x 7.5mm x 1.2mm.
Features:
- Multi-bank page burst access mode
- Auto/self-refresh feature for power-saving and reliability
- Synchronous operating mode for high-speed data transfer
- Industrial temperature range (-40°C to 85°C) for robust performance
- 16-bit data width for high bandwidth
- 256M x 16-bit memory density for large storage capacity
- Surface-mount package for easy integration into PCB designs
Applications:
- Primary applications:
- Server and storage systems
- High-performance computing systems
- Industrial automation and control systems
- Secondary applications:
- Networking and telecommunications equipment
- Medical and healthcare devices
- Aerospace and defense systems
Alternative Parts:
- H5TQ4G63CFR-RDI is an obsolete part, and alternative parts may be available. Please contact Hynix or a authorized distributor for more information.
Embedded Modules:
- This component is used in various embedded modules, including:
- Server and storage systems
- High-performance computing systems
- Industrial automation and control systems
FAQs:
Q: What is the maximum operating temperature of the H5TQ4G63CFR-RDI? A: The maximum operating temperature is 85°C.
Q: What is the minimum operating temperature of the H5TQ4G63CFR-RDI? A: The minimum operating temperature is -40°C.
Q: What is the supply voltage range of the H5TQ4G63CFR-RDI? A: The supply voltage range is 1.425V to 1.575V.
Q: Is the H5TQ4G63CFR-RDI RoHS compliant? A: Yes, the H5TQ4G63CFR-RDI is RoHS compliant.
Q: What is the package shape of the H5TQ4G63CFR-RDI? A: The package shape is rectangular, with a grid array, thin profile, and fine pitch.
Q: What is the terminal form of the H5TQ4G63CFR-RDI? A: The terminal form is ball.
H5TQ4G63CFR-RDI Relevant information
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