

AMD XCZU6CG-1FFVB1156I
Manufacturer No:
XCZU6CG-1FFVB1156I
Manufacturer:
Package:
1156-BBGA, FCBGA
Description:
-40°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC CG Series 328 I/O
Quantity:
Delivery:




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In Stock :Available
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XCZU6CG-1FFVB1156I information
AMD XCZU6CG-1FFVB1156I technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU6CG-1FFVB1156I.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Package / Case
- 1156-BBGA, FCBGA
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Bulk
- Series
- Zynq® UltraScale+? MPSoC CG
- Published
- 2016
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- HTS Code
- 8542.31.00.01
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Number of I/O
- 328
- Speed
- 500MHz, 1.2GHz
- RAM Size
- 256KB
- Core Processor
- Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?
- Peripherals
- DMA, WDT
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture
- MCU, FPGA
- Primary Attributes
- Zynq®UltraScale+? FPGA, 469K+ Logic Cells
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XCZU6CG-1FFVB1156I.
Datasheets:
Environmental Information:
This SoC is built on Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? core processor(s).
A core processor Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? is used to build this SoC.Its package is 1156-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+? MPSoC CG series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+? FPGA, 469K+ Logic Cells.It comes in a state-of-the-art Bulk package.Total I/Os on this SoC part are 328.
Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU6CG-1FFVB1156I System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
MEANS OF PAYMENTFor your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.
RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

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Step4:Individual Package

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Step6:Packaging Box
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Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
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