AMD XCZU5EG-L2SFVC784E
AMD XCZU5EG-L2SFVC784E

AMD XCZU5EG-L2SFVC784E

Manufacturer No:

XCZU5EG-L2SFVC784E

Manufacturer:

AMD

Package:

784-BFBGA, FCBGA

Description:

784 Terminations 0°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC EG Series 252 I/O 0.72V

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XCZU5EG-L2SFVC784E information

AMD XCZU5EG-L2SFVC784E technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU5EG-L2SFVC784E.

  • Type
  • Parameter
  • Factory Lead Time
  • 11 Weeks
  • Package / Case
  • 784-BFBGA, FCBGA
  • Surface Mount
  • YES
  • Operating Temperature
  • 0°C~100°C TJ
  • Packaging
  • Tray
  • Series
  • Zynq® UltraScale+? MPSoC EG
  • Published
  • 2016
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 4 (72 Hours)
  • Number of Terminations
  • 784
  • Additional Feature
  • ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
  • HTS Code
  • 8542.31.00.01
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • NOT SPECIFIED
  • Supply Voltage
  • 0.72V
  • Time@Peak Reflow Temperature-Max (s)
  • NOT SPECIFIED
  • JESD-30 Code
  • R-PBGA-B784
  • Supply Voltage-Max (Vsup)
  • 0.742V
  • Supply Voltage-Min (Vsup)
  • 0.698V
  • Number of I/O
  • 252
  • Speed
  • 533MHz, 600MHz, 1.3GHz
  • RAM Size
  • 256KB
  • Core Processor
  • Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
  • Peripherals
  • DMA, WDT
  • Connectivity
  • CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
  • MCU, FPGA
  • Primary Attributes
  • Zynq®UltraScale+? FPGA, 256K+ Logic Cells
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for AMD XCZU5EG-L2SFVC784E.

Datasheets:

Environmental Information:

This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A core processor Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.Its package is 784-BFBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+? MPSoC EG series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+? FPGA, 256K+ Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 252.A 0.72V power supply should be used.There are voltages higher than 0.742V that should be avoided when using the SoCs wireless.There is a possibility that it can be powered by a power supply of at least 0.698V.Having 784 terminations in total makes system on a chip possible.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.The SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY, which are additional features.

Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY


There are a lot of Xilinx Inc.


XCZU5EG-L2SFVC784E System On Chip (SoC) applications.


  • Vending machines
  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports

User Guide

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Step1：Prepare product

Step2：Desiccant Protection

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step3：Vacuum Packaging

Step4：Individual Package

Step4：Individual Package

Step5：Anti-collision Filling

Step5：Anti-collision Filling

Step6：Packaging Box

Step6：Packaging Box

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DELIVERY TIME

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