AMD XCZU2CG-2SFVC784E

Manufacturer No:

XCZU2CG-2SFVC784E

Manufacturer:

AMD

Package:

784-BFBGA, FCBGA

Description:

0°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC CG Series 252 I/O

Quantity:

Delivery:

Payment:

In Stock :Available

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XCZU2CG-2SFVC784E information

AMD XCZU2CG-2SFVC784E technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU2CG-2SFVC784E.

Type
Parameter

Factory Lead Time
11 Weeks

Package / Case
784-BFBGA, FCBGA

Operating Temperature
0°C~100°C TJ

Packaging
Tray

Series
Zynq® UltraScale+? MPSoC CG

Published
2016

Pbfree Code
yes

Part Status
Active

Moisture Sensitivity Level (MSL)
4 (72 Hours)

HTS Code
8542.31.00.01

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

Number of I/O
252

Speed
533MHz, 1.3GHz

RAM Size
256KB

Core Processor
Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?

Peripherals
DMA, WDT

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Primary Attributes
Zynq®UltraScale+? FPGA, 103K+ Logic Cells

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XCZU2CG-2SFVC784E.

Datasheets:

xilinxinc-xczu5cg2fbvb900i-datasheets-4568.pdf

Environmental Information:

xilinxinc-xcmechff1738-environmentalinformation-4888.pdf

This SoC is built on Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? core processor(s).

Based on the core processor(s) Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, this SoC has been developed.There is a 784-BFBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq® UltraScale+? MPSoC CG is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Zynq®UltraScale+? FPGA, 103K+ Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 252 inputs and outputs.

Dual ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.

There are a lot of Xilinx Inc.

XCZU2CG-2SFVC784E System On Chip (SoC) applications.

Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare
Medical
Remote control

User Guide

PURCHASE

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MEANS OF PAYMENT

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IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

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SHIPPING COST

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2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.