AMD XCVU11P-2FLGF1924E
AMD XCVU11P-2FLGF1924E

AMD XCVU11P-2FLGF1924E

Manufacturer No:

XCVU11P-2FLGF1924E

Manufacturer:

AMD

Package:

1924-BBGA, FCBGA

Description:

FPGAs Virtex® UltraScale+™ Series 1924-BBGA, FCBGA

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

Price not displayed? Please send an RFQ, and we will respond immediately.

XCVU11P-2FLGF1924E information

AMD XCVU11P-2FLGF1924E technical specifications, attributes, parameters and parts with similar specifications to AMD XCVU11P-2FLGF1924E.

  • Type
  • Parameter
  • Factory Lead Time
  • 11 Weeks
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 1924-BBGA, FCBGA
  • Operating Temperature
  • 0°C~100°C TJ
  • Packaging
  • Tray
  • Series
  • Virtex® UltraScale+™
  • JESD-609 Code
  • e1
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 4 (72 Hours)
  • Terminal Finish
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
  • 8542.39.00.01
  • Voltage - Supply
  • 0.825V~0.876V
  • Peak Reflow Temperature (Cel)
  • NOT SPECIFIED
  • Reach Compliance Code
  • not_compliant
  • Time@Peak Reflow Temperature-Max (s)
  • NOT SPECIFIED
  • Number of I/O
  • 624
  • Programmable Logic Type
  • FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
  • 2835000
  • Total RAM Bits
  • 396150400
  • Number of LABs/CLBs
  • 162000
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for AMD XCVU11P-2FLGF1924E.

Datasheets:

Environmental Information:

XCVU11P-2FLGF1924E Overview


Fpga chips is supplied in the 1924-BBGA, FCBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 624 I/Os for transferring data in a more coherent manner. There are 2835000 logic elements/cells to form a fundamental building block. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 0.825V~0.876V. It is a type of FPGA belonging to the Virtex® UltraScale+™ seies. The operating temperature should be kept at 0°C~100°C TJ when operating. This FPGA model is contained in Tray for space saving. The RAM bits that this device offer is 396150400. This FPGA is built as an array of 162000 LABs/CLBs.

XCVU11P-2FLGF1924E Features


624 I/Os
Up to 396150400 RAM bits


XCVU11P-2FLGF1924E Applications


There are a lot of Xilinx Inc.
XCVU11P-2FLGF1924E FPGAs applications.


  • Digital signal processing
  • Bioinformatics
  • Device controllers
  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition

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