AMD XCV600-4BG432I
AMD XCV600-4BG432I

AMD XCV600-4BG432I

Manufacturer No:

XCV600-4BG432I

Manufacturer:

AMD

Package:

432-LBGA Exposed Pad, Metal

Description:

2.5V V 1.7mm mm FPGAs Virtex® Series 432-LBGA Exposed Pad, Metal 1.27mm mm 432

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XCV600-4BG432I information

AMD XCV600-4BG432I technical specifications, attributes, parameters and parts with similar specifications to AMD XCV600-4BG432I.

  • Type
  • Parameter
  • Mount
  • Surface Mount
  • Mounting Type
  • Surface Mount
  • Package / Case
  • 432-LBGA Exposed Pad, Metal
  • Operating Temperature
  • -40°C~100°C TJ
  • Packaging
  • Tray
  • Series
  • Virtex®
  • Published
  • 2000
  • JESD-609 Code
  • e0
  • Pbfree Code
  • no
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 3 (168 Hours)
  • Number of Terminations
  • 432
  • ECCN Code
  • EAR99
  • Terminal Finish
  • Tin/Lead (Sn63Pb37)
  • Subcategory
  • Field Programmable Gate Arrays
  • Technology
  • CMOS
  • Voltage - Supply
  • 2.375V~2.625V
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • 225
  • Supply Voltage
  • 2.5V
  • Terminal Pitch
  • 1.27mm
  • Reach Compliance Code
  • not_compliant
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Pin Count
  • 432
  • Number of Outputs
  • 316
  • Qualification Status
  • Not Qualified
  • Operating Supply Voltage
  • 2.5V
  • Number of I/O
  • 316
  • RAM Size
  • 12kB
  • Clock Frequency
  • 250MHz
  • Number of Inputs
  • 316
  • Programmable Logic Type
  • FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
  • 15552
  • Total RAM Bits
  • 98304
  • Number of Gates
  • 661111
  • Number of LABs/CLBs
  • 3456
  • Speed Grade
  • 4
  • Combinatorial Delay of a CLB-Max
  • 0.8 ns
  • Height Seated (Max)
  • 1.7mm
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Contains Lead

Download datasheets and manufacturer documentation for AMD XCV600-4BG432I.

XCV600-4BG432I Overview


In the 432-LBGA Exposed Pad, Metal package, you will find fpga chips. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. The device has 316 I/O ports for more coherent data transfer. To form a fundamental building block, there are 15552 logic elements/cells. In order to operate fpga chips, a voltage supply of 2.5V volts is required. FPGA parts like this belong to the Field Programmable Gate Arrays family. Surface Mount-connectors can be used to attach this FPGA module to the development board. There is a 2.375V~2.625V-volt supply voltage required for the device to operate. The Virtex® Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within -40°C~100°C TJ when operating. A total of 316 outputs are incorporated into this device. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. 432 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 98304 bFpga chipss. You can find related parts by using the part number XCV600, which is its base part number. It is crucial that the RAM si12kBe of this FPGA module reaches 12kB so that the program can run normally. A total of 3456 LABs/CLBs are included in this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Its flexibility is fully utilized when operated with a supply voltage of 2.5V. There are 661111 gates in its basic building block. With a total of 432 pins, it is equipped with a high level of security. It usually uses a 250MHz crystal.

XCV600-4BG432I Features


316 I/Os
Up to 98304 RAM bits


XCV600-4BG432I Applications


There are a lot of Xilinx Inc.
XCV600-4BG432I FPGAs applications.


  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense

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