AMD XCV200-4BGG352C

Manufacturer No:

XCV200-4BGG352C

Manufacturer:

AMD

Package:

Description:

1.7mm mm FPGAs 1.27mm mm 352

Quantity:

In Stock :5912

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XCV200-4BGG352C Information

AMD XCV200-4BGG352C technical specifications, attributes, parameters and parts with similar specifications to AMD XCV200-4BGG352C.

Type
Parameter

Surface Mount
YES

JESD-609 Code
e1

Pbfree Code
yes

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
352

ECCN Code
EAR99

Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

HTS Code
8542.39.00.01

Technology
CMOS

Terminal Position
BOTTOM

Type
Parameter

Terminal Form
BALL

Peak Reflow Temperature (Cel)
260

Supply Voltage
2.5V

Terminal Pitch
1.27mm

Time@Peak Reflow Temperature-Max (s)
30

Pin Count
352

JESD-30 Code
S-PBGA-B352

Qualification Status
Not Qualified

Operating Temperature (Max)
85°C

Supply Voltage-Max (Vsup)
2.625V

Download datasheets and manufacturer documentation for AMD XCV200-4BGG352C.

XCV200-4BGG352C Overview

The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. The supply voltage is 2.5V volts. In total, it has 352 terminations on each end. The building block that forms the basis of the system contains 236666 gates. This device has a pin count of 352 in fpga semiconductor. It usually uses a crystal oscillating at a frequency of 250MHz in order to do its work. A CLB is a basic module that determines the architecture of a system. For this FPGA to operate correctly, the supply voltage must be greater than 2.375V. As a rule of thumb, the operating temperature should not exceed 85°C.