XC7Z045-2FBG676E-AMD-Price, Stock & Datasheet

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore? with CoreSight?, this SoC has been developed.There is a 676-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 350K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z045.During operation, the wireless SoC runs at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.In order for the SoC computing to start, 0°C is just about right.There is a maximum operating temperature of 100°C set for this SoC system on chip during its design.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z045-2FBG676E System On Chip (SoC) applications.

Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare
Medical
Remote control

AMD XC7Z045-2FBG676E

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