AMD XCS30-3BG256C
Manufacturer No:
XCS30-3BG256C
Manufacturer:
AMD
Package:
256-BBGA
Description:
5V V 2.55mm mm FPGAs Spartan® Series 256-BBGA 1.27mm mm 256
Quantity:
In Stock :4282
Looking for price or availability? Send us an RFQ and our sales team will respond quickly.
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Shipped from：HK Warehouse
Expected Shipping：Wed, Jul 1 - Thu, Jul 2, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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PURCHASE
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RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
SHIPPING COST
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XCS30-3BG256C Information
AMD XCS30-3BG256C technical specifications, attributes, parameters and parts with similar specifications to AMD XCS30-3BG256C.
- Type
- Parameter
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 256-BBGA
- Number of Pins
- 256
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Spartan®
- Published
- 1999
- JESD-609 Code
- e0
- Part Status
- Obsolete
- Type
- Parameter
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 256
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Voltage - Supply
- 4.75V~5.25V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Supply Voltage
- 5V
- Terminal Pitch
- 1.27mm
- Base Part Number
- XCS30
Download datasheets and manufacturer documentation for AMD XCS30-3BG256C.
XCS30-3BG256C Overview
There is a 256-BBGA package that includes this component. FIELD PROGRAMMABLE GATE ARRAY is the component of this type of FPGA. 192 I/Os are available for transferring data more efficiently. A fundamental building block consists of 1368 logic elements/cells. It is powered from a supply voltage of 5V. Field Programmable Gate Arrays family FPGA part. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 4.75V~5.25V is needed in order for fpga chips to operate. As part of the Spartan® series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. The device has 196 outputs that are integrated into it. As a space-saving measure, this FPGA model is contained within Tray. Total terminations are 256. There are 18432 RAM bits that are available with this device. In order to find related parts, you can use its base part number XCS30. There is a maximum RAM si2.3kBe of 2.3kB on this FPGA module, which is necessary to ensure the normal operation of the program. It has a total of 256 pins that are designed for it. 576 LABs and CLBs are built into this FPGA. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Designers can fully utilize its flexibility with 5V supply voltage. Power is provided by a 5V battery that is included with the device. There are 30000 gates that make up its basic building block. As far as the pin count is concerned, it has 256 pins. Usually, fpga semiconductor uses a 125MHz crystal. During the process of storing and transferring data, 1536 registers are used. There are 576 CLBs that make up the architecture of the system. For the building block, it incorporates 576 logic cells that are used to make it work. 10000 equivalent gates are used to implement the design in the FPGA.
XCS30-3BG256C Features
192 I/Os
Up to 18432 RAM bits
256 LABs/CLBs
1536 registers
XCS30-3BG256C Applications
There are a lot of Xilinx Inc.
XCS30-3BG256C FPGAs applications.
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
XCS30-3BG256C FAQ
Can I request a quote for XCS30-3BG256C?
XCS30-3BG256C from AMD is ready for RFQ submission. Send your target quantity and requirements, and AIChipLink will check current availability, lead time, and quantity-based pricing.
Why is pricing not shown as a fixed value for XCS30-3BG256C?
The final price for XCS30-3BG256C depends on requested quantity, supply conditions, date code, package option, and destination. An RFQ lets us return the current market quote for your order.
Which specifications should I review for XCS30-3BG256C?
XCS30-3BG256C is a AMD electronic component part. Key details include Packaging: Tray and Moisture Sensitivity Level (MSL): 3 (168 Hours) and Combinatorial Delay of a CLB-Max: 1.6 ns; contact us if you need the specifications verified before sourcing.
When will I receive a quotation for XCS30-3BG256C?
After you submit the RFQ for XCS30-3BG256C, our sales team typically replies within 24 hours with availability, unit pricing, lead time, shipping choices, and possible substitutes.
What is the expected shipping time for XCS30-3BG256C?
Once stock for XCS30-3BG256C is confirmed, available inventory can generally ship within 1–2 business days. The final schedule depends on quantity, warehouse source, and delivery address.
Can AIChipLink help find alternatives to XCS30-3BG256C?
Yes. If XCS30-3BG256C is unavailable, end-of-life, or outside your schedule, we can review comparable AMD electronic component parts and compatible replacement options.
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