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AMD XCR3384XL-10FGG324C
Manufacturer No:
XCR3384XL-10FGG324C
Manufacturer:
Package:
FBGA
Description:
1mm PMIC 3.3V FBGA
Quantity:
Delivery:




Payment:






In Stock :Available
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XCR3384XL-10FGG324C information
AMD XCR3384XL-10FGG324C technical specifications, attributes, parameters and parts with similar specifications to AMD XCR3384XL-10FGG324C.
- Type
- Parameter
- Package / Case
- FBGA
- Surface Mount
- YES
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 324
- ECCN Code
- 3A991.D
- Terminal Finish
- Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
- Max Operating Temperature
- 70°C
- Min Operating Temperature
- 0°C
- Additional Feature
- YES
- HTS Code
- 8542.39.00.01
- Subcategory
- Programmable Logic Devices
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 250
- Supply Voltage
- 3.3V
- Terminal Pitch
- 1mm
- Time@Peak Reflow Temperature-Max (s)
- 30
- Pin Count
- 324
- Operating Supply Voltage
- 3.3V
- Supply Voltage-Max (Vsup)
- 3.6V
- Temperature Grade
- COMMERCIAL
- Memory Type
- EEPROM
- Propagation Delay
- 10 ns
- Frequency (Max)
- 102MHz
- Organization
- 0 DEDICATED INPUTS, 220 I/O
- Programmable Logic Type
- EE PLD
- Number of Logic Blocks (LABs)
- 24
- Speed Grade
- 10
- Output Function
- MACROCELL
- Number of Macro Cells
- 384
- JTAG BST
- YES
- In-System Programmable
- YES
- Length
- 23mm
- Height Seated (Max)
- 2.5mm
- Width
- 23mm
- Radiation Hardening
- No
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XCR3384XL-10FGG324C.
Datasheets:
XCR3384XL-10FGG324C Overview
Currently, there are 384 macro cells, which are low-power cell sites (towers, antennas, masts) that serve as radio coverage.There is a FBGA package containing it.There are 220 I/Os on the board.Terminations of devices are set to 324.BOTTOM is the terminal position of this electrical part.A voltage of 3.3Vprovides power to the device.There is a part in the family Programmable Logic Devices.In this chip, the 324 pins are programmed.If you use this device, you will also find YES.Optimal efficiency requires a supply voltage of 3.3V.For data storage, EEPROM is adopted.In this case, the maximum supply voltage (Vsup) is 3.6V.It is recommended that the operating temperature exceeds 0°C.A temperature lower than 70°C is recommended for operation.The program consists of 24 logic blocks (LABs).Maximum frequency should be less than 102MHz.It is possible to classify programmable logic as EE PLD.
XCR3384XL-10FGG324C Features
FBGA package
220 I/Os
324 pin count
24 logic blocks (LABs)
XCR3384XL-10FGG324C Applications
There are a lot of Xilinx
XCR3384XL-10FGG324C CPLDs applications.
- Bootloaders for FPGAs
- Address decoders
- Custom state machines
- Digital systems
- Portable digital devices
- Handheld digital devices
- Battery operated portable devices
- Complex programmable logic devices
- Digital designs
- Field programmable gate
User Guide
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