AMD XCR3512XL-10FTG256C

Manufacturer No:

XCR3512XL-10FTG256C

Manufacturer:

AMD

Package:

Description:

1mm PMIC 256 Pin 3.3V

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XCR3512XL-10FTG256C information

AMD XCR3512XL-10FTG256C technical specifications, attributes, parameters and parts with similar specifications to AMD XCR3512XL-10FTG256C.

Type
Parameter

Mount
Surface Mount

Number of Pins
256

JESD-609 Code
e1

Pbfree Code
yes

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
256

ECCN Code
3A991.D

Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Max Operating Temperature
70°C

Min Operating Temperature
0°C

Additional Feature
YES

HTS Code
8542.39.00.01

Subcategory
Programmable Logic Devices

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
260

Supply Voltage
3.3V

Terminal Pitch
1mm

Time@Peak Reflow Temperature-Max (s)
30

Pin Count
256

Qualification Status
Not Qualified

Operating Supply Voltage
3.3V

Supply Voltage-Max (Vsup)
3.6V

Number of I/O
212

Memory Type
EEPROM

Propagation Delay
10 ns

Frequency (Max)
97MHz

Programmable Logic Type
EE PLD

Number of Gates
12000

Number of Logic Blocks (LABs)
32

Speed Grade
10

Output Function
MACROCELL

Number of Macro Cells
512

JTAG BST
YES

In-System Programmable
YES

Length
17mm

Height Seated (Max)
1.55mm

Width
17mm

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XCR3512XL-10FTG256C.

XCR3512XL-10FTG256C Overview

512 macrocells are present in the mobile phone network, which offer radio coverage from a high-power cell tower, antenna, or mast.The device is programmed with 212 I/O ports.It is programmed to terminate devices at 256.There is a BOTTOM terminal position on the electrical part in question.The device is powered by a voltage of 3.3V volts.It is a part of the family Programmable Logic Devices.With 256 pins programmed, the chip is ready to use.When using this device, YES is also available.12000 gates are used to construct digital circuits.If high efficiency is desired, the supply voltage should be kept at 3.3V.It is recommended that data be stored in EEPROM.In this case, it is mounted by Surface Mount.The pins are 256.Initially, the maximum supply voltage (Vsup) is 3.6V.It is recommended that the operating temperature be higher than 0°C.It is recommended that the operating temperature be below 70°C.32 logic blocks (LABs) make up this circuit.If the maximal frequency is less than 97MHz, it should be lower than that.In programmable logic, a type of logic can be categorized as EE PLD.

XCR3512XL-10FTG256C Features

212 I/Os
256 pin count
256 pins
32 logic blocks (LABs)

XCR3512XL-10FTG256C Applications

There are a lot of Xilinx
XCR3512XL-10FTG256C CPLDs applications.

Digital systems
Portable digital devices
Handheld digital devices
Battery operated portable devices
Complex programmable logic devices
Digital designs
Field programmable gate
Address decoding
D/T registers and latches
Synchronous or asynchronous mode

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