AMD XCR3384XL-10FGG324I

Manufacturer No:

XCR3384XL-10FGG324I

Manufacturer:

AMD

Package:

FBGA

Description:

1mm PMIC 3.3V FBGA

Quantity:

Delivery:

Payment:

In Stock :Available

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XCR3384XL-10FGG324I information

AMD XCR3384XL-10FGG324I technical specifications, attributes, parameters and parts with similar specifications to AMD XCR3384XL-10FGG324I.

Type
Parameter

Package / Case
FBGA

Surface Mount
YES

JESD-609 Code
e1

Pbfree Code
yes

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
324

ECCN Code
3A991.D

Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Max Operating Temperature
85°C

Min Operating Temperature
-40°C

Additional Feature
YES

HTS Code
8542.39.00.01

Subcategory
Programmable Logic Devices

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
250

Supply Voltage
3.3V

Terminal Pitch
1mm

Time@Peak Reflow Temperature-Max (s)
30

Pin Count
324

Operating Supply Voltage
3.3V

Supply Voltage-Max (Vsup)
3.6V

Temperature Grade
INDUSTRIAL

Memory Type
EEPROM

Propagation Delay
10 ns

Frequency (Max)
102MHz

Organization
0 DEDICATED INPUTS, 220 I/O

Programmable Logic Type
EE PLD

Number of Logic Blocks (LABs)
24

Speed Grade
10

Output Function
MACROCELL

Number of Macro Cells
384

JTAG BST
YES

In-System Programmable
YES

Length
23mm

Height Seated (Max)
2.5mm

Width
23mm

Radiation Hardening
No

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XCR3384XL-10FGG324I.

XCR3384XL-10FGG324I Overview

There are 384 macro cells, which are cells in a mobile phone network that provides radio coverage served by a high-power cell site (tower, antenna or mast).It is embedded in the FBGA package.It is programmed with 220 I/Os.There are 324 terminations, which are the practice of ending a transmission line with a device that matches the characteristic impedance of the line.The terminal position of this electrical part is BOTTOM, which serves as an important access point for passengers or freight.It is powered from a supply voltage of 3.3V.This part is included in Programmable Logic Devices.It is equipped with 324 pin count.It is also characterized by YES.The supply voltage should be maintained at 3.3V for high efficiency.EEPROM is adopted for storing data.The maximal supply voltage (Vsup) reaches 3.6V.The operating temperature should be higher than -40°C.The operating temperature should be lower than 85°C.Its basic building block is composed of 24 logic blocks (LABs).The maximal frequency should be lower than 102MHz.This kind of FPGA is composed of EE PLD.

XCR3384XL-10FGG324I Features

FBGA package
220 I/Os
324 pin count
24 logic blocks (LABs)

XCR3384XL-10FGG324I Applications

There are a lot of Xilinx
XCR3384XL-10FGG324I CPLDs applications.

Power up sequencing
Voltage level translation
Timing control
Interface bridging
I/O expansion
Discrete logic functions
Bootloaders for FPGAs
Address decoders
Custom state machines
Digital systems

User Guide

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SHIPPING METHOD

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DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.