AMD XCR3512XL-10FGG324C

Manufacturer No:

XCR3512XL-10FGG324C

Manufacturer:

AMD

Package:

FBGA

Description:

1mm PMIC 324 Pin 3.3V FBGA

Quantity:

Delivery:

Payment:

In Stock :Available

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XCR3512XL-10FGG324C information

AMD XCR3512XL-10FGG324C technical specifications, attributes, parameters and parts with similar specifications to AMD XCR3512XL-10FGG324C.

Type
Parameter

Factory Lead Time
6 Weeks

Mount
Surface Mount

Package / Case
FBGA

Number of Pins
324

Published
1996

JESD-609 Code
e1

Pbfree Code
yes

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
324

ECCN Code
3A991.D

Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

Max Operating Temperature
70°C

Min Operating Temperature
0°C

Additional Feature
YES

HTS Code
8542.39.00.01

Subcategory
Programmable Logic Devices

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
250

Supply Voltage
3.3V

Terminal Pitch
1mm

Time@Peak Reflow Temperature-Max (s)
30

Qualification Status
Not Qualified

Operating Supply Voltage
3.3V

Supply Voltage-Max (Vsup)
3.6V

Temperature Grade
COMMERCIAL

Number of I/O
260

Memory Type
EEPROM

Propagation Delay
10 ns

Frequency (Max)
97MHz

Programmable Logic Type
EE PLD

Number of Gates
12000

Number of Logic Blocks (LABs)
32

Speed Grade
10

Output Function
MACROCELL

Number of Macro Cells
512

JTAG BST
YES

In-System Programmable
YES

Length
23mm

Height Seated (Max)
2.5mm

Width
23mm

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XCR3512XL-10FGG324C.

Datasheets:

xilinx-xcr3512xl10fgg324c-datasheets-6130.pdf

XCR3512XL-10FGG324C Overview

The mobile phone network has 512 macro cells, which are cells that provide radio coverage from high-power cell sites (towers, antennas, or masts).In the FBGA package, you will find it.In this case, there are 260 I/Os programmed.324 terminations are programmed into the device.This electrical component has a terminal position of BOTTOM.An electrical supply voltage of 3.3V is used to power it.The part belongs to Programmable Logic Devices family.A chip with 324 pins is programmed.This device also displays YES.A digital circuit can be constructed using 12000 gates.In order to achieve high efficiency, the supply voltage should be maintained at 3.3V.In this case, EEPROM will be used to store the data.Surface Mount is the mounting point of this electronic part.The device has a pinout of 324.There is a maximum supply voltage (Vsup) of 3.6V.Operating temperatures should be higher than 0°C.Ideally, the operating temperature should be below 70°C.There are 32 logic blocks (LABs) that make up its basic building block.It should be below 97MHz at the maximal frequency.Programmable logic types are divided into EE PLD.

XCR3512XL-10FGG324C Features

FBGA package
260 I/Os
324 pin count
324 pins
32 logic blocks (LABs)

XCR3512XL-10FGG324C Applications

There are a lot of Xilinx
XCR3512XL-10FGG324C CPLDs applications.

I/O expansion
Discrete logic functions
Bootloaders for FPGAs
Address decoders
Custom state machines
Digital systems
Portable digital devices
Handheld digital devices
Battery operated portable devices
Complex programmable logic devices

User Guide

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