AMD XCKU3P-2FFVD900E
Manufacturer No:
XCKU3P-2FFVD900E
Manufacturer:
AMD
Package:
900-BBGA, FCBGA
Description:
FPGAs Kintex® UltraScale+™ Series 900-BBGA, FCBGA
Quantity:
In Stock :6756
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Shipped from：HK Warehouse
Expected Shipping：Thu, May 28 - Fri, May 29, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XCKU3P-2FFVD900E Information
AMD XCKU3P-2FFVD900E technical specifications, attributes, parameters and parts with similar specifications to AMD XCKU3P-2FFVD900E.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 900-BBGA, FCBGA
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Tray
- Series
- Kintex® UltraScale+™
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Type
- Parameter
- Terminal Finish
- Tin/Silver/Copper (Sn/Ag/Cu)
- HTS Code
- 8542.39.00.01
- Voltage - Supply
- 0.825V~0.876V
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Number of I/O
- 304
- Programmable Logic Type
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells
- 355950
- Total RAM Bits
- 31641600
- Number of LABs/CLBs
- 20340
Download datasheets and manufacturer documentation for AMD XCKU3P-2FFVD900E.
Datasheets:
Environmental Information:
XCKU3P-2FFVD900E Overview
As part of the 900-BBGA, FCBGA package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 304 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 355950 logic elements/cells. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 0.825V~0.876V . It is a type of FPGA that belongs to the Kintex® UltraScale+™ series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~100°C TJ when operating the machine. In order to save space, this FPGA model has been contained in Tray. This device has 31641600 RAM bits, which is the number of RAM bits that this device offers. The FPGA consists of 20340 LABs/CLBs.
XCKU3P-2FFVD900E Features
304 I/Os
Up to 31641600 RAM bits
XCKU3P-2FFVD900E Applications
There are a lot of Xilinx Inc.
XCKU3P-2FFVD900E FPGAs applications.
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
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12.28 M
Listed Part Number
3,000+
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