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AMD XC6SLX9-L1CSG324C
Manufacturer No:
XC6SLX9-L1CSG324C
Manufacturer:
AMD
Package:
BGA
Description:
1V V 1.5mm mm FPGAs BGA 0.8mm mm 324
Quantity:
In Stock :2735
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Expected Shipping：Thu, Jun 11 - Fri, Jun 12, 2026
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Date Code：Within 2 Years
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XC6SLX9-L1CSG324C Information
AMD XC6SLX9-L1CSG324C technical specifications, attributes, parameters and parts with similar specifications to AMD XC6SLX9-L1CSG324C.
- Type
- Parameter
- Mount
- Surface Mount
- Package / Case
- BGA
- Number of Pins
- 324
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 324
- ECCN Code
- 3A991.D
- Terminal Finish
- TIN SILVER COPPER
- Max Operating Temperature
- 85°C
- Type
- Parameter
- Min Operating Temperature
- 0°C
- HTS Code
- 8542.39.00.01
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 260
- Supply Voltage
- 1V
- Terminal Pitch
- 0.8mm
- Time@Peak Reflow Temperature-Max (s)
- 30
Download datasheets and manufacturer documentation for AMD XC6SLX9-L1CSG324C.
XC6SLX9-L1CSG324C Overview
As part of the BGA package, it is included. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 200 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 9152 logic elements/cells. It is powered from a supply voltage of 1V. The Field Programmable Gate Arrays family of FPGA parts includes this part. In this device, there are 200 outputs that can be used. There are a total of 324 terminations. Fpga electronics is important that this FPGA module has a RAM si72kBe of 72kB in order to ensure that the program will run normally. There are 324 pins on this device. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. Its flexibility can be fully utilized when operating with a 1V supply voltage. An external power supply of 12.5/3.3V is required to power the device. There is a maximum operating temperature of 85°C for this module. Fpga electronics is recommended that the operating temperature be higher than 0°C. There are a total of 324 pins on this device. There are 715 logic blocks (LABs) that make up the system's basic building block. To store and transfer data, there are 11440 registers that are used. Its architecture is based on 715 CLBs.
XC6SLX9-L1CSG324C Features
200 I/Os
324 LABs/CLBs
85°C gates
715 logic blocks (LABs)
11440 registers
XC6SLX9-L1CSG324C Applications
There are a lot of Xilinx
XC6SLX9-L1CSG324C FPGAs applications.
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
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