AMD XC7Z045-1FFG900C

Manufacturer No:

XC7Z045-1FFG900C

Manufacturer:

AMD

Package:

900-BBGA, FCBGA

Description:

900 Terminations 0°C~85°C TJ 900 Pin XC7Z045 System On Chip Zynq®-7000 Series 130 I/O 1V Min 1.2V V Max 3.3V V

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XC7Z045-1FFG900C information

AMD XC7Z045-1FFG900C technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z045-1FFG900C.

Type
Parameter

Factory Lead Time
10 Weeks

Contact Plating
Copper, Silver, Tin

Package / Case
900-BBGA, FCBGA

Surface Mount
YES

Number of Pins
900

Operating Temperature
0°C~85°C TJ

Packaging
Tray

Series
Zynq®-7000

Published
2009

JESD-609 Code
e1

Part Status
Active

Moisture Sensitivity Level (MSL)
4 (72 Hours)

Number of Terminations
900

ECCN Code
3A991.D

Terminal Finish
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

HTS Code
8542.39.00.01

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
245

Supply Voltage
1V

Terminal Pitch
1mm

Frequency
667MHz

Time@Peak Reflow Temperature-Max (s)
30

Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

Max Supply Voltage
3.3V

Min Supply Voltage
1.2V

Number of I/O
130

RAM Size
256KB

Memory Type
ROMless

Core Processor
Dual ARM® Cortex®-A9 MPCore? with CoreSight?

Peripherals
DMA

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Data Bus Width
32b

Number of Logic Elements/Cells
190000

Core Architecture
ARM

Boundary Scan
YES

Speed Grade
-1

RAM (words)
256000

Primary Attributes
Kintex?-7 FPGA, 350K Logic Cells

Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB

Length
31mm

Height Seated (Max)
3.35mm

Radiation Hardening
No

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC7Z045-1FFG900C.

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

A Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 900-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Zynq®-7000 series.The average operating temps for this SoC meaning should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines Kintex?-7 FPGA, 350K Logic Cells.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.It is advised to utilize a 1V power supply.There are 900 terminations in total and that really benefits system on a chip.You can get system on chips with similar specs and purposes by searching XC7Z045.The wireless SoC works at a frequency of 667MHz.The SoC meaning is based on the core architecture of ARM.This is the 900-pin version of the computer SoC.It is rated with 3.3V maximum supply voltage.It is supplied with at least 1.2V power.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z045-1FFG900C System On Chip (SoC) applications.

Automotive gateway
Body control module
Industrial transport
Industrial robot
High-end PLC
Vending machines
POS Terminals
Measurement tools
Measurement testers
Networked sensors

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