AMD XC7Z015-1CLG485C

Manufacturer No:

XC7Z015-1CLG485C

Manufacturer:

AMD

Package:

484-LFBGA, CSPBGA

Description:

485 Terminations 0°C~85°C TJ 485 Pin System On Chip Zynq®-7000 Series 130 I/O 1V

Quantity:

Delivery:

Payment:

In Stock :Available

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XC7Z015-1CLG485C information

AMD XC7Z015-1CLG485C technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z015-1CLG485C.

Type
Parameter

Factory Lead Time
10 Weeks

Contact Plating
Copper, Silver, Tin

Package / Case
484-LFBGA, CSPBGA

Surface Mount
YES

Number of Pins
485

Operating Temperature
0°C~85°C TJ

Packaging
Tray

Series
Zynq®-7000

Published
2010

JESD-609 Code
e1

Part Status
Active

Moisture Sensitivity Level (MSL)
3 (168 Hours)

Number of Terminations
485

ECCN Code
EAR99

Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)

Subcategory
Other Microprocessor ICs

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
NOT SPECIFIED

Supply Voltage
1V

Terminal Pitch
0.8mm

Frequency
667MHz

Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED

Supply Voltage-Min (Vsup)
0.95V

Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

Number of I/O
130

RAM Size
256KB

uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT

Core Processor
Dual ARM® Cortex®-A9 MPCore? with CoreSight?

Peripherals
DMA

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Data Bus Width
32b

Core Architecture
ARM

Boundary Scan
YES

Speed Grade
1

RAM (words)
256000

Primary Attributes
Artix?-7 FPGA, 74K Logic Cells

Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB

UV Erasable
N

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC7Z015-1CLG485C.

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore? with CoreSight?, this SoC has been developed.There is a 484-LFBGA, CSPBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~85°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Artix?-7 FPGA, 74K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.As long as it receives a power supply that is at least 0.95V, it should be able to function.system on a chip benefits from 485 terminations.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Other Microprocessor ICs.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.During operation, the wireless SoC runs at a frequency of 667MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 485.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z015-1CLG485C System On Chip (SoC) applications.

Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare
Medical
Remote control

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