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AMD XC7S25-1FTGB196Q
Manufacturer No:
XC7S25-1FTGB196Q
Manufacturer:
Package:
196-LBGA, CSPBGA
Description:
1.55mm mm FPGAs Spartan®-7 Series 196-LBGA, CSPBGA 1mm mm 196
Quantity:
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XC7S25-1FTGB196Q Information
AMD XC7S25-1FTGB196Q technical specifications, attributes, parameters and parts with similar specifications to AMD XC7S25-1FTGB196Q.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mounting Type
- Surface Mount
- Package / Case
- 196-LBGA, CSPBGA
- Surface Mount
- YES
- Operating Temperature
- -40°C~125°C TJ
- Series
- Spartan®-7
- JESD-609 Code
- e3
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 196
- Type
- Parameter
- Terminal Finish
- Matte Tin (Sn)
- HTS Code
- 8542.39.00.01
- Voltage - Supply
- 0.95V~1.05V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Supply Voltage
- 1V
- Terminal Pitch
- 1mm
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- JESD-30 Code
- S-PBGA-B196
Download datasheets and manufacturer documentation for AMD XC7S25-1FTGB196Q.
Datasheets:
Environmental Information:
XC7S25-1FTGB196Q Description
Xilinx® 7 series FPGAs comprise four FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding
high-performance applications. Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, XC7S25-1FTGB196Q FPGA enables an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
XC7S25-1FTGB196Q Features
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
A user-configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
Quickly deploy embedded processing with MicroBlaze™ processor.
XC7S25-1FTGB196Q Applications
Communications equipment
Wireless infrastructure
Industrial
Medical
Enterprise systems
Enterprise projectors
XC7S25-1FTGB196Q Relevant information
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