

AMD XC6VHX380T-2FFG1924I
Manufacturer No:
XC6VHX380T-2FFG1924I
Manufacturer:
Package:
1924-BBGA, FCBGA
Description:
3.85mm mm 220 ps ns FPGAs Virtex®-6 HXT Series 1924-BBGA, FCBGA 1mm mm
Quantity:
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Step1:Prepare product

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step4:Individual Package

Step5:Anti-collision Filling

Step6:Packaging Box
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Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XC6VHX380T-2FFG1924I Information
AMD XC6VHX380T-2FFG1924I technical specifications, attributes, parameters and parts with similar specifications to AMD XC6VHX380T-2FFG1924I.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Contact Plating
- Copper, Silver, Tin
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 1924-BBGA, FCBGA
- Number of Pins
- 1924
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Virtex®-6 HXT
- Published
- 2008
- Type
- Parameter
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- ECCN Code
- 3A001.A.7.B
- Terminal Finish
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
- Subcategory
- Field Programmable Gate Arrays
- Technology
- CMOS
- Voltage - Supply
- 0.95V~1.05V
- Terminal Position
- BOTTOM
Download datasheets and manufacturer documentation for AMD XC6VHX380T-2FFG1924I.
Datasheets:
Environmental Information:
PCN Design/Specification:
PCN Assembly/Origin:
XC6VHX380T-2FFG1924I Description
The XC6VHX380T-2FFG1924I is a Virtex®-6 FPGA n for Targeted Design Platforms that deliver integrated software and hardware components to enable designers to focus on innovation as soon as their development cycle begins.
XC6VHX380T-2FFG1924I Features
1.2 to 2.5V /O operation
Source-synchronous interfacing using ChipSyncTM technology
Digitally controlled impedance (DCI) active termination
Flexible fine-grained /O banking
High-speed memory, interface support with the integrated write-levelling capability
40 nm copper CMOS process technology
1.0V core voltage (-1, -2, -3 speed grades only)
Lower-power 0.9V core voltage option (-1L speed grade only)
High signal-integrity flip-chip packaging is available in
standard or Pb-free package options
XC6VHX380T-2FFG1924I Applications
Industrial
XC6VHX380T-2FFG1924I Relevant information
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