AMD XC6SLX25T-3FGG484I
Manufacturer No:
XC6SLX25T-3FGG484I
Manufacturer:
Package:
484-BBGA
Description:
1.2V V FPGAs Spartan®-6 LXT Series 484-BBGA
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Delivery:
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In Stock :Available
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XC6SLX25T-3FGG484I information
AMD XC6SLX25T-3FGG484I technical specifications, attributes, parameters and parts with similar specifications to AMD XC6SLX25T-3FGG484I.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 484-BBGA
- Number of Pins
- 484
- Supplier Device Package
- 484-FBGA (23x23)
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Spartan®-6 LXT
- Published
- 1998
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Max Operating Temperature
- 100°C
- Min Operating Temperature
- -40°C
- Voltage - Supply
- 1.14V~1.26V
- Base Part Number
- XC6SLX25
- Operating Supply Voltage
- 1.2V
- Number of I/O
- 250
- RAM Size
- 117kB
- Number of Logic Elements/Cells
- 24051
- Total RAM Bits
- 958464
- Number of LABs/CLBs
- 1879
- Number of Logic Blocks (LABs)
- 1879
- Speed Grade
- 3
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XC6SLX25T-3FGG484I.
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XC6SLX25T-3FGG484I Overview
The package that contains this software is called 484-BBGA. There are 250 I/Os for better data transfer. In order to construct a fundamental building block, 24051 logic elements/cells are required. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~1.26V battery. There are many types of FPGAs in the Spartan®-6 LXT series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As far as the RAM bits are concerned, this device offers you a total of 958464. If you are looking for related parts, you can use the base part number XC6SLX25 as a starting point. For the program to work properly, the RAM si117kBe of this FPGA module must reach 117kB GB in order to ensure normal operation. In this case, 484 pins are used in the design. 1879 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. When this module is operated at its maximum operating temperature, it reaches 100°C. A higher operating temperature than -40°C is recommended. There are 1879 logic blocks (LABs) in the system, which form its basic building blocks. In order to store and transfer data, a total of 30064 registers are used. The supplier of the device package is 484-FBGA (23x23).
XC6SLX25T-3FGG484I Features
250 I/Os
Up to 958464 RAM bits
484 LABs/CLBs
100°C gates
1879 logic blocks (LABs)
30064 registers
XC6SLX25T-3FGG484I Applications
There are a lot of Xilinx Inc.
XC6SLX25T-3FGG484I FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
User Guide
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
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