AMD XC5VLX330-2FF1760C
Manufacturer No:
XC5VLX330-2FF1760C
Manufacturer:
Package:
1760-BBGA, FCBGA
Description:
1V V 3.5mm mm FPGAs Virtex®-5 LX Series 1760-BBGA, FCBGA 1mm mm
Quantity:
Delivery:
Payment:
In Stock :Available
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XC5VLX330-2FF1760C information
AMD XC5VLX330-2FF1760C technical specifications, attributes, parameters and parts with similar specifications to AMD XC5VLX330-2FF1760C.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 1760-BBGA, FCBGA
- Number of Pins
- 1760
- Number of I/Os
- 1200
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Virtex®-5 LX
- Published
- 1999
- JESD-609 Code
- e0
- Pbfree Code
- no
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- ECCN Code
- 3A001.A.7.A
- Terminal Finish
- Tin/Lead (Sn63Pb37)
- Voltage - Supply
- 0.95V~1.05V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 225
- Supply Voltage
- 1V
- Terminal Pitch
- 1mm
- Reach Compliance Code
- not_compliant
- Time@Peak Reflow Temperature-Max (s)
- 30
- Qualification Status
- Not Qualified
- Operating Supply Voltage
- 1V
- RAM Size
- 1.3MB
- Programmable Logic Type
- FIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells
- 331776
- Total RAM Bits
- 10616832
- Number of LABs/CLBs
- 25920
- Speed Grade
- 2
- Height Seated (Max)
- 3.5mm
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XC5VLX330-2FF1760C.
Datasheets:
PCN Design/Specification:
Product Description:
The XC5VLX330-2FF1760C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx Inc., part of the Virtex-5 LX series. This device is designed to provide exceptional processing power and flexibility for a wide range of applications. With a maximum height of 3.5mm, the XC5VLX330-2FF1760C is a surface-mount device that operates within a temperature range of 0°C to 85°C.
Features:
- High-Performance Processing: The XC5VLX330-2FF1760C features 331,776 logic elements, 25,920 LABs/CLBs, and 12,000 I/Os, making it an ideal choice for demanding applications.
- Large RAM Capacity: The device boasts a total RAM capacity of 1.3MB, ensuring efficient data storage and processing.
- Flexible Packaging: Available in a 1760-BBGA, FCBGA package, the XC5VLX330-2FF1760C offers flexibility in terms of board design and layout.
- Low Power Consumption: Operating at a supply voltage of 1V, the device is designed to minimize power consumption and reduce heat generation.
Applications:
- Primary Applications:
- High-performance computing and data processing
- Advanced telecommunications and networking systems
- High-speed digital signal processing and filtering
- Secondary Applications:
- Medical imaging and diagnostic equipment
- Aerospace and defense systems
- Industrial automation and control systems
Alternative Parts:
- XC5VLX330-2FF1760C is an alternative to other high-performance FPGAs from Xilinx, such as the XC5VLX220-2FF1152C and XC5VLX280-2FF1760C.
Embedded Modules:
- The XC5VLX330-2FF1760C is used in various embedded systems, including:
- High-performance computing platforms
- Advanced telecommunications equipment
- Medical imaging and diagnostic devices
FAQs:
Q: What is the operating temperature range of the XC5VLX330-2FF1760C? A: The operating temperature range is 0°C to 85°C.
Q: What is the supply voltage of the XC5VLX330-2FF1760C? A: The supply voltage is 1V.
Q: What is the packaging type of the XC5VLX330-2FF1760C? A: The packaging type is a 1760-BBGA, FCBGA package.
Q: Is the XC5VLX330-2FF1760C RoHS compliant? A: No, the XC5VLX330-2FF1760C is not RoHS compliant.
Q: What is the factory lead time for the XC5VLX330-2FF1760C? A: The factory lead time is 10 weeks.
Q: What is the moisture sensitivity level (MSL) of the XC5VLX330-2FF1760C? A: The MSL is 4 (72 hours).
User Guide
Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.
MEANS OF PAYMENTFor your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.
RFQ (REQUEST FOR QUOTATIONS)Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.
Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.
Step1：Prepare product
Step2：Desiccant Protection
Step3：Vacuum Packaging
Step4：Individual Package
Step5：Anti-collision Filling
Step6：Packaging Box
1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.
Currently, our products are shipped through DHL, FedEx, SF, and UPS.
DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
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