AMD XC3S200-4FTG256C
Manufacturer No:
XC3S200-4FTG256C
Manufacturer:
Package:
256-LBGA
Description:
1.2V V FPGAs Spartan®-3 Series 256-LBGA 256
Quantity:
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XC3S200-4FTG256C Information
AMD XC3S200-4FTG256C technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S200-4FTG256C.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 256-LBGA
- Number of Pins
- 256
- Number of I/Os
- 173
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Spartan®-3
- Published
- 2006
- Type
- Parameter
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 256
- ECCN Code
- EAR99
- Voltage - Supply
- 1.14V~1.26V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 260
Download datasheets and manufacturer documentation for AMD XC3S200-4FTG256C.
Datasheets:
Environmental Information:
Product Description:
The XC3S200-4FTG256C is a high-performance, field-programmable gate array (FPGA) from Xilinx Inc. This Spartan-3 series device is designed for a wide range of applications, including digital signal processing, data storage, and communications. With its 256-pin, 256-LBGA package, the XC3S200-4FTG256C offers a compact and reliable solution for embedded systems.
Features:
- 27kB RAM size
- 4320 logic elements/cells
- 480 LABs/CLBs
- 173 I/Os
- 200,000 gates
- 630MHz clock frequency
- Combinatorial delay of a CLB-max: 0.61ns
- Operating temperature range: 0°C to 85°C TJ
- Supply voltage: 1.2V
- Pbfree code: yes
- RoHS3 compliant
- Lead free
Applications:
- Digital signal processing
- Data storage
- Communications
- Embedded systems
Alternative Parts:
- XC3S200-4FTG256C is a part of the Spartan-3 series, which includes other devices with similar features and specifications. Some alternative parts include:
- XC3S200-4FTG256C
- XC3S200-4FTG256I
- XC3S200-4FTG256C
Embedded Modules:
- The XC3S200-4FTG256C is used in various embedded modules, including:
- Xilinx's own embedded modules, such as the Zynq-7000 SoC
- Third-party embedded modules, such as those from Avnet and Digilent
FAQs:
Q: What is the peak reflow temperature of the XC3S200-4FTG256C? A: The peak reflow temperature is 260°C.
Q: What is the operating temperature range of the XC3S200-4FTG256C? A: The operating temperature range is 0°C to 85°C TJ.
Q: What is the supply voltage of the XC3S200-4FTG256C? A: The supply voltage is 1.2V.
Q: Is the XC3S200-4FTG256C RoHS compliant? A: Yes, the XC3S200-4FTG256C is RoHS3 compliant.
Q: What is the lead free status of the XC3S200-4FTG256C? A: The XC3S200-4FTG256C is lead free.
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