AMD XC3S1000-4FGG676I
Manufacturer No:
XC3S1000-4FGG676I
Manufacturer:
AMD
Package:
676-BGA
Description:
1.2V V FPGAs Spartan®-3 Series 676-BGA 1mm mm 676
Quantity:
In Stock :1470
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Shipped from：HK Warehouse
Expected Shipping：Thu, May 28 - Fri, May 29, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XC3S1000-4FGG676I Information
AMD XC3S1000-4FGG676I technical specifications, attributes, parameters and parts with similar specifications to AMD XC3S1000-4FGG676I.
- Type
- Parameter
- Factory Lead Time
- 10 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 676-BGA
- Number of Pins
- 676
- Number of I/Os
- 391
- Operating Temperature
- -40°C~100°C TJ
- Packaging
- Tray
- Series
- Spartan®-3
- Published
- 2006
- Type
- Parameter
- JESD-609 Code
- e1
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Number of Terminations
- 676
- ECCN Code
- 3A991.D
- Voltage - Supply
- 1.14V~1.26V
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 250
Download datasheets and manufacturer documentation for AMD XC3S1000-4FGG676I.
Datasheets:
Environmental Information:
PCN Design/Specification:
XC3S1000-4FGG676I Overview
The package that contains this software is called 676-BGA. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. In order to construct a fundamental building block, 17280 logic elements/cells are required. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~1.26V battery. There are many types of FPGAs in the Spartan®-3 series, this is one of them. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. A device such as this one has 391 outputs built into it. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has a total of 676 terminations. As far as the RAM bits are concerned, this device offers you a total of 442368. If you are looking for related parts, you can use the base part number XC3S1000 as a starting point. For the program to work properly, the RAM si54kBe of this FPGA module must reach 54kB GB in order to ensure normal operation. In this case, 676 pins are used in the design. 1920 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. In order for fpga electronics to work, fpga electronics requires a 1.21.2/3.32.5V power supply. As a basic building block, fpga semiconductor consists of 1000000 gates. A total of 676 pins are included in this device. Most of the time, it uses a crystal oscillating at 630MHz to generate the signal.
XC3S1000-4FGG676I Features
Up to 442368 RAM bits
676 LABs/CLBs
XC3S1000-4FGG676I Applications
There are a lot of Xilinx Inc.
XC3S1000-4FGG676I FPGAs applications.
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
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