AMD XCZU6EG-2FFVB1156E
Manufacturer No:
XCZU6EG-2FFVB1156E
Manufacturer:
AMD
Package:
1156-BBGA, FCBGA
Description:
0°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC EG Series 328 I/O
Quantity:
In Stock :6143
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Shipped from：HK Warehouse
Expected Shipping：Sun, Jun 7 - Mon, Jun 8, 2026
Lead Time：Inquire about availability
Date Code：Within 2 Years
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DELIVERY TIME1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.
XCZU6EG-2FFVB1156E Information
AMD XCZU6EG-2FFVB1156E technical specifications, attributes, parameters and parts with similar specifications to AMD XCZU6EG-2FFVB1156E.
- Type
- Parameter
- Factory Lead Time
- 11 Weeks
- Package / Case
- 1156-BBGA, FCBGA
- Operating Temperature
- 0°C~100°C TJ
- Packaging
- Tray
- Series
- Zynq® UltraScale+? MPSoC EG
- Published
- 2013
- Pbfree Code
- yes
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- HTS Code
- 8542.31.00.01
- Type
- Parameter
- Peak Reflow Temperature (Cel)
- NOT SPECIFIED
- Time@Peak Reflow Temperature-Max (s)
- NOT SPECIFIED
- Number of I/O
- 328
- Speed
- 533MHz, 600MHz, 1.3GHz
- RAM Size
- 256KB
- Core Processor
- Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
- Peripherals
- DMA, WDT
- Connectivity
- CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Architecture
- MCU, FPGA
- Primary Attributes
- Zynq®UltraScale+? FPGA, 469K+ Logic Cells
Download datasheets and manufacturer documentation for AMD XCZU6EG-2FFVB1156E.
Datasheets:
Environmental Information:
This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A core processor Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.Its package is 1156-BBGA, FCBGA.A 256KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+? MPSoC EG series.For this SoC meaning, the average operating temperature should be 0°C~100°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+? FPGA, 469K+ Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 328.
Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU6EG-2FFVB1156E System On Chip (SoC) applications.
- Vending machines
- POS Terminals
- Measurement tools
- Measurement testers
- Networked sensors
- Robotics
- Central alarm system
- Smart appliances
- Industrial automation devices
- Sports
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