AMD XC2V6000-4FF1152C
Manufacturer No:
XC2V6000-4FF1152C
Manufacturer:
Package:
FCBGA
Description:
1.5V V FPGAs FCBGA 1mm mm 1152
Quantity:
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XC2V6000-4FF1152C Information
AMD XC2V6000-4FF1152C technical specifications, attributes, parameters and parts with similar specifications to AMD XC2V6000-4FF1152C.
- Type
- Parameter
- Package / Case
- FCBGA
- Surface Mount
- YES
- JESD-609 Code
- e0
- Pbfree Code
- no
- Moisture Sensitivity Level (MSL)
- 4 (72 Hours)
- Number of Terminations
- 1152
- ECCN Code
- EAR99
- Terminal Finish
- Tin/Lead (Sn63Pb37)
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- 0°C
- Type
- Parameter
- Terminal Position
- BOTTOM
- Terminal Form
- BALL
- Peak Reflow Temperature (Cel)
- 225
- Supply Voltage
- 1.5V
- Terminal Pitch
- 1mm
- Time@Peak Reflow Temperature-Max (s)
- 30
- Pin Count
- 1152
- JESD-30 Code
- S-PBGA-B1152
- Number of Outputs
- 824
- Operating Supply Voltage
- 1.5V
Download datasheets and manufacturer documentation for AMD XC2V6000-4FF1152C.
Product Description:
The XC2V6000-4FF1152C is a high-performance, field-programmable gate array (FPGA) from Xilinx, designed to provide exceptional flexibility and scalability for a wide range of applications. With a clock frequency of 650MHz, this device offers unparalleled processing power and speed, making it an ideal choice for demanding embedded systems.
Features:
- 6.6 million equivalent gates for unparalleled processing power
- 76,032 logic cells for complex logic and arithmetic operations
- 67,584 registers for efficient data storage and processing
- 324KB of RAM for temporary data storage
- 824 inputs and 824 outputs for high-speed data transfer
- 1.5V operating supply voltage for efficient power consumption
- FCBGA package with 1,152 pins for easy integration and connectivity
- Surface mount technology for compact and reliable packaging
- Non-RoHS compliant for compatibility with legacy systems
Applications:
- High-performance embedded systems for industrial automation, medical devices, and aerospace applications
- Data acquisition and processing systems for scientific research and instrumentation
- Network infrastructure and telecommunications systems for high-speed data transmission
- Automotive systems for advanced driver assistance and infotainment applications
Alternative Parts:
- XC2V6000-4FF1152C: A high-performance FPGA with a clock frequency of 650MHz
- XC2V5000-4FF1152C: A mid-range FPGA with a clock frequency of 500MHz
- XC2V4000-4FF1152C: A low-power FPGA with a clock frequency of 400MHz
Embedded Modules:
- Xilinx Virtex-6 FPGA modules for high-performance embedded systems
- Xilinx Kintex-7 FPGA modules for mid-range embedded systems
- Xilinx Artix-7 FPGA modules for low-power embedded systems
FAQs:
Q: What is the maximum operating temperature of the XC2V6000-4FF1152C? A: The maximum operating temperature is 85°C.
Q: What is the minimum operating temperature of the XC2V6000-4FF1152C? A: The minimum operating temperature is 0°C.
Q: Is the XC2V6000-4FF1152C radiation-hardened? A: No, the XC2V6000-4FF1152C is not radiation-hardened.
Q: What is the package type of the XC2V6000-4FF1152C? A: The package type is FCBGA.
Q: What is the terminal finish of the XC2V6000-4FF1152C? A: The terminal finish is Tin/Lead (Sn63Pb37).
I hope this product description meets your requirements. If you need any further assistance, please let me know.
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