AMD XC17S50APDG8C

Manufacturer No:

XC17S50APDG8C

Manufacturer:

AMD

Package:

8-DIP (0.300, 7.62mm)

Description:

Through Hole 500kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S50A

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XC17S50APDG8C information

AMD XC17S50APDG8C technical specifications, attributes, parameters and parts with similar specifications to AMD XC17S50APDG8C.

Type
Parameter

Mounting Type
Through Hole

Package / Case
8-DIP (0.300, 7.62mm)

Surface Mount
NO

Number of Pins
8

Operating Temperature
0°C~70°C

Packaging
Tube

Published
1999

JESD-609 Code
e3

Pbfree Code
yes

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
1 (Unlimited)

Number of Terminations
8

ECCN Code
EAR99

Terminal Finish
Matte Tin (Sn)

Technology
CMOS

Voltage - Supply
3V~3.6V

Terminal Position
DUAL

Peak Reflow Temperature (Cel)
250

Number of Functions
1

Supply Voltage
3.3V

Terminal Pitch
2.54mm

Time@Peak Reflow Temperature-Max (s)
30

Base Part Number
XC17S50A

Pin Count
8

Supply Voltage-Max (Vsup)
3.6V

Supply Voltage-Min (Vsup)
3V

Programmable Type
OTP

Memory Size
500kb

Supply Current-Max
0.015mA

Organization
559200X1

Output Characteristics
3-STATE

Memory Width
1

Density
1 Mb

Standby Current-Max
0.001A

Parallel/Serial
SERIAL

I/O Type
COMMON

Memory IC Type
CONFIGURATION MEMORY

Length
9.3599mm

Height Seated (Max)
4.5974mm

Width
7.62mm

Radiation Hardening
No

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC17S50APDG8C.

XC17S50APDG8C Overview

This package is based on a neat 8-DIP (0.300, 7.62mm) package which is used by it.Packaging for the external use of Tube.In the state of 0°C~70°C, licensed to work.Using the OTP axis, it can be programmed to do whatever you want.FPGA is powered by a voltage which is 3V~3.6V volts, and this voltage is the voltage from which the generator is powered.I have mounted this memory device in Through Hole.Currently, data storage can only store data up to 500kb bytes.Try searching "XC17S50A" for more parts.There is a voltage requirement of 3.3V for supplying it with power.FPGA is possible to connect different functions on the 8 axis at different terminations.In order to use this memory device, a maximum voltage of 3.6V should be used.If the device needs to be supplied with power, then a minimum voltage of 3V is required.FPGA is a CONFIGURATION MEMORY memory chip that we are talking about here.Reflow soldering should be done at 250°C maximum.In this case, it has 8 pins.With the help of SERIAL-processing, data is sent through this memory.In order for a memory chip to function properly, it must be subjected to a voltage of not more than 0.015mA.There is a set of 8 pins that are included with the part.The memory's I/O is configured to be COMMON in terms of its configuration.The 3.3V company recommends that users apply 3.3V to a part before using it so the part will be able to run safely and reliably in a circuit.

XC17S50APDG8C Features

Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S50APDG8C Applications

There are a lot of Xilinx Inc.
XC17S50APDG8C applications of configuration proms for FPGAs.

telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
hard disk drive (HDD)

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