AMD XC17S30XLPD8C

Manufacturer No:

XC17S30XLPD8C

Manufacturer:

AMD

Package:

8-DIP (0.300, 7.62mm)

Description:

Through Hole 300kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S30XL not_compliant

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XC17S30XLPD8C information

AMD XC17S30XLPD8C technical specifications, attributes, parameters and parts with similar specifications to AMD XC17S30XLPD8C.

Type
Parameter

Mounting Type
Through Hole

Package / Case
8-DIP (0.300, 7.62mm)

Surface Mount
NO

Number of Pins
8

Operating Temperature
0°C~70°C

Packaging
Tube

Published
1999

JESD-609 Code
e0

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
Not Applicable

Number of Terminations
8

ECCN Code
EAR99

Technology
CMOS

Voltage - Supply
3V~3.6V

Terminal Position
DUAL

Number of Functions
1

Supply Voltage
3.3V

Terminal Pitch
2.54mm

Reach Compliance Code
not_compliant

Base Part Number
XC17S30XL

Pin Count
8

Qualification Status
Not Qualified

Supply Voltage-Max (Vsup)
3.6V

Power Supplies
3.3V

Programmable Type
OTP

Memory Size
300kb

Operating Mode
SYNCHRONOUS

Clock Frequency
10MHz

Supply Current-Max
0.005mA

Output Characteristics
3-STATE

Memory Width
1

Standby Current-Max
0.00005A

I/O Type
COMMON

Memory IC Type
MEMORY CIRCUIT

Length
9.3599mm

Height Seated (Max)
4.5974mm

Width
7.62mm

RoHS Status
RoHS Compliant

Lead Free
Contains Lead

Download datasheets and manufacturer documentation for AMD XC17S30XLPD8C.

Datasheets:

xilinx-xc17s30xlpd8c-datasheets-4404.pdf

XC17S30XLPD8C Overview

The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packaging outside of Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.The OTP programming language can be used to program it.The voltage fed to it is 3V~3.6V.Mounted in Through Hole is this memory device.A data storage size of 300kb is allowed.Search "XC17S30XL" for related parts.The supply voltage is 3.3V.With different functions, 8 terminations can be used.FPGA is possible to use this memory device at a maximum voltage of 3.6V.Minimum voltage 3V is required for the device to work.A MEMORY CIRCUIT memory chip like this is used for data storage.FPGA is equipped wFPGAh 8 pins.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.005mA.Parts include 8 pins.Using a 10MHz frequency, this memory IC can work at high speeds.Memory is configured as COMMON for memory's I/O.In order to obtain the best performance, it is recommended to use a 3.3V power supply.

XC17S30XLPD8C Features

Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S30XLPD8C Applications

There are a lot of Xilinx Inc.
XC17S30XLPD8C applications of configuration proms for FPGAs.

mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer

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