AMD XC7Z030-2FFG676E

Manufacturer No:

XC7Z030-2FFG676E

Manufacturer:

AMD

Package:

676-BBGA, FCBGA

Description:

676 Terminations 0°C~100°C TJ 676 Pin XC7Z030 System On Chip Zynq®-7000 Series 130 I/O 1V

Quantity:

Delivery:

Payment:

In Stock :Available

Price not displayed? Please send an RFQ, and we will respond immediately.

XC7Z030-2FFG676E information

AMD XC7Z030-2FFG676E technical specifications, attributes, parameters and parts with similar specifications to AMD XC7Z030-2FFG676E.

Type
Parameter

Factory Lead Time
10 Weeks

Contact Plating
Copper, Silver, Tin

Package / Case
676-BBGA, FCBGA

Surface Mount
YES

Number of Pins
676

Operating Temperature
0°C~100°C TJ

Packaging
Tray

Series
Zynq®-7000

Published
2009

JESD-609 Code
e1

Part Status
Active

Moisture Sensitivity Level (MSL)
4 (72 Hours)

Number of Terminations
676

ECCN Code
3A991.D

Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)

HTS Code
8542.39.00.01

Technology
CMOS

Terminal Position
BOTTOM

Terminal Form
BALL

Peak Reflow Temperature (Cel)
245

Supply Voltage
1V

Terminal Pitch
1mm

Frequency
800MHz

Time@Peak Reflow Temperature-Max (s)
30

Operating Supply Voltage
1V

Supply Voltage-Max (Vsup)
1.05V

Interface
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

Number of I/O
130

RAM Size
256KB

Core Processor
Dual ARM® Cortex®-A9 MPCore? with CoreSight?

Peripherals
DMA

Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture
MCU, FPGA

Data Bus Width
32b

Core Architecture
ARM

Boundary Scan
YES

Speed Grade
-2

RAM (words)
256000

Primary Attributes
Kintex?-7 FPGA, 125K Logic Cells

Bus Compatibility
CAN; ETHERNET; I2C; SPI; UART; USB

Length
27mm

Height Seated (Max)
3.24mm

Radiation Hardening
No

RoHS Status
ROHS3 Compliant

Download datasheets and manufacturer documentation for AMD XC7Z030-2FFG676E.

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore? with CoreSight?, this SoC has been developed.There is a 676-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 125K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.system on a chip benefits from 676 terminations.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z030.During operation, the wireless SoC runs at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 676.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z030-2FFG676E System On Chip (SoC) applications.

Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare
Medical
Remote control

User Guide

PURCHASE

Please verify all part numbers, quantities, and packaging preferences before placing your order. If substitutions are acceptable, please indicate this clearly. For time-sensitive projects, confirm estimated delivery dates and stock availability in advance. Once submitted, changes or cancellations may not be possible, especially for items marked as non-cancellable/non-returnable (NCNR). For international shipments, please ensure all import documentation is complete and accurate to avoid delays.

MEANS OF PAYMENT

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and Wire Transfer. Net terms may be available for qualified customers upon approval.

RFQ (REQUEST FOR QUOTATIONS)

Please ensure the part numbers and quantities are accurate and complete when submitting your RFQ.
Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1：Prepare product

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step4：Individual Package

Step5：Anti-collision Filling

Step6：Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.