XC7Z030-2FFG676E-AMD-Price, Stock & Datasheet

This SoC is built on Dual ARM® Cortex®-A9 MPCore? with CoreSight? core processor(s).

Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore? with CoreSight?, this SoC has been developed.There is a 676-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.Zynq®-7000 is the series name of this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.A significant feature of this SoC security is the combination of Kintex?-7 FPGA, 125K Logic Cells.There is a state-of-the-art Tray package that houses this SoC system on a chip.As a whole, this SoC part is comprised of 130 inputs and outputs.Ideally, a power supply with a voltage of 1V should be used.An excessive voltage of 1.05V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.system on a chip benefits from 676 terminations.It is possible to find system on chips that are similar in specs and purpose by searching for XC7Z030.During operation, the wireless SoC runs at a frequency of 800MHz.There are a number of features to this SoC meaning which are based on the core architecture of ARM.The computer SoC has a pin count of 676.

Dual ARM® Cortex®-A9 MPCore? with CoreSight? processor.

256KB RAM.
Built on MCU, FPGA.
Core Architecture: ARM

There are a lot of Xilinx Inc.

XC7Z030-2FFG676E System On Chip (SoC) applications.

Networked sensors
Robotics
Central alarm system
Smart appliances
Industrial automation devices
Sports
Fitness
Healthcare
Medical
Remote control

AMD XC7Z030-2FFG676E

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