AMD XC17S200APDG8I
AMD XC17S200APDG8I

AMD XC17S200APDG8I

Manufacturer No:

XC17S200APDG8I

Manufacturer:

AMD

Package:

8-DIP (0.300, 7.62mm)

Description:

Through Hole 2Mb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S200A

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XC17S200APDG8I information

AMD XC17S200APDG8I technical specifications, attributes, parameters and parts with similar specifications to AMD XC17S200APDG8I.

  • Type
  • Parameter
  • Mounting Type
  • Through Hole
  • Package / Case
  • 8-DIP (0.300, 7.62mm)
  • Surface Mount
  • NO
  • Number of Pins
  • 8
  • Operating Temperature
  • -40°C~85°C
  • Packaging
  • Tube
  • Published
  • 1999
  • JESD-609 Code
  • e3
  • Pbfree Code
  • yes
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 1 (Unlimited)
  • Number of Terminations
  • 8
  • ECCN Code
  • EAR99
  • Terminal Finish
  • Matte Tin (Sn)
  • Technology
  • CMOS
  • Voltage - Supply
  • 3V~3.6V
  • Terminal Position
  • DUAL
  • Peak Reflow Temperature (Cel)
  • 250
  • Number of Functions
  • 1
  • Supply Voltage
  • 3.3V
  • Terminal Pitch
  • 2.54mm
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Base Part Number
  • XC17S200A
  • Pin Count
  • 8
  • Supply Voltage-Max (Vsup)
  • 3.6V
  • Supply Voltage-Min (Vsup)
  • 3V
  • Programmable Type
  • OTP
  • Memory Size
  • 2Mb
  • Supply Current-Max
  • 0.015mA
  • Output Characteristics
  • 3-STATE
  • Memory Width
  • 1
  • Standby Current-Max
  • 0.001A
  • Parallel/Serial
  • SERIAL
  • I/O Type
  • COMMON
  • Memory IC Type
  • CONFIGURATION MEMORY
  • Length
  • 9.3599mm
  • Height Seated (Max)
  • 4.5974mm
  • Width
  • 7.62mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC17S200APDG8I.

XC17S200APDG8I Overview


The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packaging outside of Tube.Qualified to perform a variety of tasks within the -40°C~85°C environment.The OTP programming language can be used to program it.The voltage fed to it is 3V~3.6V.Mounted in Through Hole is this memory device.A data storage size of 2Mb is allowed.Search "XC17S200A" for related parts.The supply voltage is 3.3V.With different functions, 8 terminations can be used.FPGA is possible to use this memory device at a maximum voltage of 3.6V.Minimum voltage 3V is required for the device to work.A CONFIGURATION MEMORY memory chip like this is used for data storage.If reflow soldering is being performed, the temperature should not be higher than 250 when soldering should be reflowed.FPGA is equipped wFPGAh 8 pins.As a result of the SERIAL process, data is transmitted from this memory.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.015mA.Parts include 8 pins.Memory is configured as COMMON for memory's I/O.A 3.3V application is recommended before using the part in a circuit to ensure the part runs safely and reliably.

XC17S200APDG8I Features


Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.


XC17S200APDG8I Applications


There are a lot of Xilinx Inc.
XC17S200APDG8I applications of configuration proms for FPGAs.


  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer

User Guide

PURCHASE

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Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

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SHIPPING METHOD

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DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.