

AMD XC17S200APDG8I
Manufacturer No:
XC17S200APDG8I
Manufacturer:
Package:
8-DIP (0.300, 7.62mm)
Description:
Through Hole 2Mb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S200A
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XC17S200APDG8I information
AMD XC17S200APDG8I technical specifications, attributes, parameters and parts with similar specifications to AMD XC17S200APDG8I.
- Type
- Parameter
- Mounting Type
- Through Hole
- Package / Case
- 8-DIP (0.300, 7.62mm)
- Surface Mount
- NO
- Number of Pins
- 8
- Operating Temperature
- -40°C~85°C
- Packaging
- Tube
- Published
- 1999
- JESD-609 Code
- e3
- Pbfree Code
- yes
- Part Status
- Obsolete
- Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Number of Terminations
- 8
- ECCN Code
- EAR99
- Terminal Finish
- Matte Tin (Sn)
- Technology
- CMOS
- Voltage - Supply
- 3V~3.6V
- Terminal Position
- DUAL
- Peak Reflow Temperature (Cel)
- 250
- Number of Functions
- 1
- Supply Voltage
- 3.3V
- Terminal Pitch
- 2.54mm
- Time@Peak Reflow Temperature-Max (s)
- 30
- Base Part Number
- XC17S200A
- Pin Count
- 8
- Supply Voltage-Max (Vsup)
- 3.6V
- Supply Voltage-Min (Vsup)
- 3V
- Programmable Type
- OTP
- Memory Size
- 2Mb
- Supply Current-Max
- 0.015mA
- Output Characteristics
- 3-STATE
- Memory Width
- 1
- Standby Current-Max
- 0.001A
- Parallel/Serial
- SERIAL
- I/O Type
- COMMON
- Memory IC Type
- CONFIGURATION MEMORY
- Length
- 9.3599mm
- Height Seated (Max)
- 4.5974mm
- Width
- 7.62mm
- Radiation Hardening
- No
- RoHS Status
- RoHS Compliant
Download datasheets and manufacturer documentation for AMD XC17S200APDG8I.
XC17S200APDG8I Overview
The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packaging outside of Tube.Qualified to perform a variety of tasks within the -40°C~85°C environment.The OTP programming language can be used to program it.The voltage fed to it is 3V~3.6V.Mounted in Through Hole is this memory device.A data storage size of 2Mb is allowed.Search "XC17S200A" for related parts.The supply voltage is 3.3V.With different functions, 8 terminations can be used.FPGA is possible to use this memory device at a maximum voltage of 3.6V.Minimum voltage 3V is required for the device to work.A CONFIGURATION MEMORY memory chip like this is used for data storage.If reflow soldering is being performed, the temperature should not be higher than 250 when soldering should be reflowed.FPGA is equipped wFPGAh 8 pins.As a result of the SERIAL process, data is transmitted from this memory.In order for a memory chip to operate, it must not be subjected to a voltage greater than 0.015mA.Parts include 8 pins.Memory is configured as COMMON for memory's I/O.A 3.3V application is recommended before using the part in a circuit to ensure the part runs safely and reliably.
XC17S200APDG8I Features
Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.
XC17S200APDG8I Applications
There are a lot of Xilinx Inc.
XC17S200APDG8I applications of configuration proms for FPGAs.
- mainframes
- multimedia computers
- networking
- personal computers
- servers
- supercomputers
- telecommunications
- workstations,
- DVD disk buffer
- data buffer
User Guide
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