AMD XC17S200APD8C
AMD XC17S200APD8C

AMD XC17S200APD8C

Manufacturer No:

XC17S200APD8C

Manufacturer:

AMD

Package:

8-DIP (0.300, 7.62mm)

Description:

Through Hole 2Mb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S200A

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XC17S200APD8C information

AMD XC17S200APD8C technical specifications, attributes, parameters and parts with similar specifications to AMD XC17S200APD8C.

  • Type
  • Parameter
  • Mounting Type
  • Through Hole
  • Package / Case
  • 8-DIP (0.300, 7.62mm)
  • Surface Mount
  • NO
  • Number of Pins
  • 8
  • Operating Temperature
  • 0°C~70°C
  • Packaging
  • Tube
  • Published
  • 1999
  • JESD-609 Code
  • e0
  • Pbfree Code
  • no
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • Not Applicable
  • Number of Terminations
  • 8
  • ECCN Code
  • EAR99
  • Technology
  • CMOS
  • Voltage - Supply
  • 3V~3.6V
  • Terminal Position
  • DUAL
  • Peak Reflow Temperature (Cel)
  • 225
  • Number of Functions
  • 1
  • Supply Voltage
  • 3.3V
  • Terminal Pitch
  • 2.54mm
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Base Part Number
  • XC17S200A
  • Pin Count
  • 8
  • Operating Supply Voltage
  • 3.3V
  • Supply Voltage-Min (Vsup)
  • 3V
  • Programmable Type
  • OTP
  • Memory Size
  • 2Mb
  • Supply Current-Max
  • 0.015mA
  • Output Characteristics
  • 3-STATE
  • Memory Width
  • 1
  • Standby Current-Max
  • 0.001A
  • Parallel/Serial
  • SERIAL
  • I/O Type
  • COMMON
  • Memory IC Type
  • CONFIGURATION MEMORY
  • Length
  • 9.3599mm
  • Height Seated (Max)
  • 4.5974mm
  • Width
  • 7.62mm
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant
  • Lead Free
  • Contains Lead

Download datasheets and manufacturer documentation for AMD XC17S200APD8C.

Datasheets:

XC17S200APD8C Overview


8-DIP (0.300, 7.62mm) is used in this package.External packaging of type Tube.As a qualified employee, I can operate within 0°C~70°C.OTP allows for programmability.The voltage is 3V~3.6V.There is a memory device mounted in Through Hole.A maximum of 2Mb bytes of data can be stored.For other related parts, search "XC17S200A".3.3V is the voltage it requires as a supply.Different functions can be assigned to 8 terminations.3.6V is the maximum voltage that can be used with this memory device.3V is the minimum voltage required to supply the device.Using CONFIGURATION MEMORY memory chips, this is what you get.In reflow soldering, the temperature should be controlled to a maximum of 225 degrees during the process.Pins on it are 8-shaped.SERIAL-process memory transmits data.An operating voltage of 0.015mA is allowed for the memory chip.The part comes with a set of 8 pins.This memory has a COMMON configuration for its I/O.Memory is recommended that users apply 3.3V to the part before use in order for Memory to function safely in a circuMemory.

XC17S200APD8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.


XC17S200APD8C Applications


There are a lot of Xilinx Inc.
XC17S200APD8C applications of configuration proms for FPGAs.


  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer

User Guide

PURCHASE

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IMPORTANT NOTICE

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Step1：Prepare product

Step1：Prepare product

Step2：Desiccant Protection

Step2：Desiccant Protection

Step3：Vacuum Packaging

Step3：Vacuum Packaging

Step4：Individual Package

Step4：Individual Package

Step5：Anti-collision Filling

Step5：Anti-collision Filling

Step6：Packaging Box

Step6：Packaging Box

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SHIPPING METHOD

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DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.

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