AMD XC17S10XLPDG8C

Manufacturer No:

XC17S10XLPDG8C

Manufacturer:

AMD

Package:

8-DIP (0.300, 7.62mm)

Description:

Through Hole 100kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC17S10XL unknown

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XC17S10XLPDG8C information

AMD XC17S10XLPDG8C technical specifications, attributes, parameters and parts with similar specifications to AMD XC17S10XLPDG8C.

Type
Parameter

Mounting Type
Through Hole

Package / Case
8-DIP (0.300, 7.62mm)

Surface Mount
NO

Number of Pins
8

Operating Temperature
0°C~70°C

Packaging
Tube

Published
1999

JESD-609 Code
e3

Part Status
Obsolete

Moisture Sensitivity Level (MSL)
1 (Unlimited)

Number of Terminations
8

ECCN Code
EAR99

Terminal Finish
Matte Tin (Sn)

Technology
CMOS

Voltage - Supply
3V~3.6V

Terminal Position
DUAL

Peak Reflow Temperature (Cel)
250

Number of Functions
1

Supply Voltage
3.3V

Terminal Pitch
2.54mm

Reach Compliance Code
unknown

Time@Peak Reflow Temperature-Max (s)
30

Base Part Number
XC17S10XL

Pin Count
8

Supply Voltage-Max (Vsup)
3.6V

Power Supplies
3.3V

Supply Voltage-Min (Vsup)
3V

Programmable Type
OTP

Memory Size
100kb

Operating Mode
SYNCHRONOUS

Clock Frequency
10MHz

Supply Current-Max
0.005mA

Organization
95752X1

Output Characteristics
3-STATE

Memory Width
1

Standby Current-Max
0.00005A

Memory Density
95752 bit

I/O Type
COMMON

Memory IC Type
MEMORY CIRCUIT

Length
9.3599mm

Height Seated (Max)
4.5974mm

Width
7.62mm

RoHS Status
RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC17S10XLPDG8C.

XC17S10XLPDG8C Overview

There is a neat 8-DIP (0.300, 7.62mm) package that is used in this program.Packaging for the external environment.0°C~70°C-qualified.With the help of OTP, it can be programmed.A voltage of 3V~3.6V is applied to it in order to power it.Through Hole is the mounting position of this memory device.Data storage is limited to a size of 100kb bytes.Other components related to "XC17S10XL" can also be found by searching the word.There is a requirement that it is supplied with a voltage of 3.3V.There are different functions associated with 8 terminations.There is a maximum voltage of 3.6V that can be applied to this memory device.FPGA is essential that a minimum voltage of 3V be supplied to the device in order for FPGA to function.The memory chip in question is a MEMORY CIRCUIT memory chip.The temperature should be kept below 250 in reflow soldering.A 8 pin is included in it.For the memory chip to operate, it requires a voltage not exceeding 0.005mA.There is a set of 8 pins included with the part.When it comes to speed, this is a memory IC that can work at a frequency of 10MHz, which is very fast.As far as memory I/O is concerned, it is configured as COMMON.The best power supply to use is a 3.3V power supply, which is highly recommended.

XC17S10XLPDG8C Features

Operating temperature: 0°C~70°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S10XLPDG8C Applications

There are a lot of Xilinx Inc.
XC17S10XLPDG8C applications of configuration proms for FPGAs.

personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic

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