AMD XC1765EPDG8C
AMD XC1765EPDG8C

AMD XC1765EPDG8C

Manufacturer No:

XC1765EPDG8C

Manufacturer:

AMD

Package:

8-DIP (0.300, 7.62mm)

Description:

Through Hole 65kb Mb Tube Configuration Proms for FPGAs 1 (Unlimited) OTP Obsolete XC1765E

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

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XC1765EPDG8C information

AMD XC1765EPDG8C technical specifications, attributes, parameters and parts with similar specifications to AMD XC1765EPDG8C.

  • Type
  • Parameter
  • Mounting Type
  • Through Hole
  • Package / Case
  • 8-DIP (0.300, 7.62mm)
  • Surface Mount
  • NO
  • Number of Pins
  • 8
  • Operating Temperature
  • 0°C~70°C
  • Packaging
  • Tube
  • Published
  • 2004
  • JESD-609 Code
  • e3
  • Pbfree Code
  • yes
  • Part Status
  • Obsolete
  • Moisture Sensitivity Level (MSL)
  • 1 (Unlimited)
  • Number of Terminations
  • 8
  • Termination
  • Through Hole
  • ECCN Code
  • EAR99
  • Terminal Finish
  • Matte Tin (Sn)
  • Additional Feature
  • USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
  • Technology
  • CMOS
  • Voltage - Supply
  • 4.75V~5.25V
  • Terminal Position
  • DUAL
  • Peak Reflow Temperature (Cel)
  • 250
  • Number of Functions
  • 1
  • Supply Voltage
  • 5V
  • Terminal Pitch
  • 2.54mm
  • Time@Peak Reflow Temperature-Max (s)
  • 30
  • Pin Count
  • 8
  • Supply Voltage-Max (Vsup)
  • 5.25V
  • Power Supplies
  • 5V
  • Supply Voltage-Min (Vsup)
  • 4.75V
  • Programmable Type
  • OTP
  • Interface
  • Serial
  • Memory Size
  • 65kb
  • Memory Type
  • PROM
  • Clock Frequency
  • 10MHz
  • Supply Current-Max
  • 0.01mA
  • Organization
  • 64KX1
  • Output Characteristics
  • 3-STATE
  • Memory Width
  • 1
  • Density
  • 64 kb
  • Standby Current-Max
  • 0.00005A
  • I/O Type
  • COMMON
  • Length
  • 9.3599mm
  • Height Seated (Max)
  • 4.5974mm
  • Width
  • 7.62mm
  • REACH SVHC
  • No SVHC
  • Radiation Hardening
  • No
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for AMD XC1765EPDG8C.

Datasheets:

XC1765EPDG8C Overview


A neat 8-DIP (0.300, 7.62mm) package is used.Packaging for external use.A qualified individual who has the ability to operate within 0°C~70°C.Using OTP, you can program it.A voltage of 4.75V~5.25V is applied to it.The memory device is mounted in Through Hole.Data storage is limited to 65kb bytes.Other related parts can be found by searching "XC1765E".5V is the required supply voltage.Different functions are associated with 8 terminations.A maximum voltage of 5.25V can be applied to this memory device.It is necessary to supply the device with a minimum voltage of 4.75V.FPGA is recommended that the reflow soldering temperature be maintained at no more than 250 during the process.8 pins are present.Memory chips can operate at a voltage no higher than 0.01mA.Parts come with 8 pins set.In terms of speed, this is a memory IC that operates at a 10MHz frequency.A COMMON configuration is used for the memory's I/O.5V power supplies are recommended.In order to better serve the needs, USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS is included.This type of memory is called a PROM memory.

XC1765EPDG8C Features


Operating temperature: 0°C~70°C.
OTP program capability.
COMMON I/O equipped.
PROM memory


XC1765EPDG8C Applications


There are a lot of Xilinx Inc.
XC1765EPDG8C applications of configuration proms for FPGAs.


  • cell phones
  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,

User Guide

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Step1：Prepare product

Step1：Prepare product

Step2：Desiccant Protection

Step2：Desiccant Protection

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Step3：Vacuum Packaging

Step4：Individual Package

Step4：Individual Package

Step5：Anti-collision Filling

Step5：Anti-collision Filling

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Step6：Packaging Box

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SHIPPING METHOD

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DELIVERY TIME

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2. For in-stock parts, orders normally could be shipped out within 1-2days.

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