AMD XAZU2EG-1SFVA625I
AMD XAZU2EG-1SFVA625I

AMD XAZU2EG-1SFVA625I

Manufacturer No:

XAZU2EG-1SFVA625I

Manufacturer:

AMD

Package:

625-BFBGA, FCBGA

Description:

625 Terminations -40°C~100°C TJ System On Chip Zynq® UltraScale+? MPSoC EG Series 128 I/O 0.85V

Delivery:

DHL
DHL
DHL
DHL

Payment:

DHL
DHL
DHL
DHL
DHL
DHL
DHL

In Stock :Available

Price not displayed? Please send an RFQ, and we will respond immediately.

XAZU2EG-1SFVA625I information

AMD XAZU2EG-1SFVA625I technical specifications, attributes, parameters and parts with similar specifications to AMD XAZU2EG-1SFVA625I.

  • Type
  • Parameter
  • Factory Lead Time
  • 11 Weeks
  • Package / Case
  • 625-BFBGA, FCBGA
  • Surface Mount
  • YES
  • Operating Temperature
  • -40°C~100°C TJ
  • Packaging
  • Tray
  • Series
  • Zynq® UltraScale+? MPSoC EG
  • Part Status
  • Active
  • Moisture Sensitivity Level (MSL)
  • 4 (72 Hours)
  • Number of Terminations
  • 625
  • HTS Code
  • 8542.31.00.01
  • Technology
  • CMOS
  • Terminal Position
  • BOTTOM
  • Terminal Form
  • BALL
  • Peak Reflow Temperature (Cel)
  • NOT SPECIFIED
  • Supply Voltage
  • 0.85V
  • Terminal Pitch
  • 0.8mm
  • Time@Peak Reflow Temperature-Max (s)
  • NOT SPECIFIED
  • JESD-30 Code
  • S-PBGA-B625
  • Number of I/O
  • 128
  • Speed
  • 500MHz, 1.2GHz
  • RAM Size
  • 1.2MB
  • uPs/uCs/Peripheral ICs Type
  • MICROPROCESSOR CIRCUIT
  • Core Processor
  • Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
  • Peripherals
  • DMA, WDT
  • Architecture
  • MPU, FPGA
  • Primary Attributes
  • Zynq®UltraScale+? FPGA, 103K+ Logic Cells
  • Length
  • 21mm
  • Height Seated (Max)
  • 3.43mm
  • Width
  • 21mm
  • RoHS Status
  • RoHS Compliant

Download datasheets and manufacturer documentation for AMD XAZU2EG-1SFVA625I.

This SoC is built on Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A core processor(s) Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 625-BFBGA, FCBGA.With 1.2MB RAM implemented, this SoC chip provides users with a high level of performance.The SoC design uses MPU, FPGA architecture for its internal architecture.Zynq® UltraScale+? MPSoC EG is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.This SoC security combines Zynq®UltraScale+? FPGA, 103K+ Logic Cells, an important feature to keep in mind.Featured in the state-of-the-art Tray package, this SoC system on a chip provides outstanding performance.128 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 0.85V.In total, there are 625 terminations, so system on a chip is really aided by this.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.

Quad ARM® Cortex®-A53 MPCore? with CoreSight?, Dual ARM®Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


1.2MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT


There are a lot of Xilinx Inc.


XAZU2EG-1SFVA625I System On Chip (SoC) applications.


  • POS Terminals
  • Measurement tools
  • Measurement testers
  • Networked sensors
  • Robotics
  • Central alarm system
  • Smart appliances
  • Industrial automation devices
  • Sports
  • Fitness

User Guide

PURCHASE

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MEANS OF PAYMENT

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RFQ (REQUEST FOR QUOTATIONS)

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Provide target prices and acceptable alternatives, if any, to speed up the quotation process.

IMPORTANT NOTICE

Quotations are subject to stock availability and may vary with market conditions. Prices and lead times are not guaranteed until a purchase order is confirmed. Ensure your contact details are correct to avoid delays in response.

Step1:Prepare product

Step1:Prepare product

Step2:Desiccant Protection

Step2:Desiccant Protection

Step3:Vacuum Packaging

Step3:Vacuum Packaging

Step4:Individual Package

Step4:Individual Package

Step5:Anti-collision Filling

Step5:Anti-collision Filling

Step6:Packaging Box

Step6:Packaging Box

SHIPPING COST

1. Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.).
2. Some specific products need to reach the minimum order quantity.
3. It may cost additional remote fees for delivery if you are in a remote area.

SHIPPING METHOD

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

DELIVERY TIME

1. Once the goods are shipped, estimated delivery time depends on the shipping methods you chose: FedEx International, 5-7 business days.
2. For in-stock parts, orders normally could be shipped out within 1-2days.