

Microchip U1AFS600-FG256
Manufacturer No:
U1AFS600-FG256
Manufacturer:
Package:
256-LBGA
Description:
FPGAs Fusion® Series 256-LBGA
Quantity:


In Stock :6886
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U1AFS600-FG256 Information
Microchip U1AFS600-FG256 technical specifications, attributes, parameters and parts with similar specifications to Microchip U1AFS600-FG256.
- Type
- Parameter
- Lifecycle Status
- IN PRODUCTION (Last Updated: 1 month ago)
- Factory Lead Time
- 14 Weeks
- Mount
- Surface Mount
- Mounting Type
- Surface Mount
- Package / Case
- 256-LBGA
- Number of Pins
- 256
- Supplier Device Package
- 256-FPBGA (17x17)
- Operating Temperature
- 0°C~85°C TJ
- Packaging
- Tray
- Series
- Fusion®
- Type
- Parameter
- Published
- 2013
- Part Status
- Active
- Moisture Sensitivity Level (MSL)
- 3 (168 Hours)
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- 0°C
- Voltage - Supply
- 1.425V~1.575V
- Base Part Number
- U1AFS600
- Number of I/O
- 114
- RAM Size
- 4.5kB
- Total RAM Bits
- 36864
Download datasheets and manufacturer documentation for Microchip U1AFS600-FG256.
U1AFS600-FG256 Overview
There is a 256-LBGA package that includes this component. 114 I/Os are available for transferring data more efficiently. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 1.425V~1.575V is needed in order for fpga chips to operate. As part of the Fusion® series of FPGAs, it is a type of FPGA. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. As a space-saving measure, this FPGA model is contained within Tray. There are 36864 RAM bits that are available with this device. In order to find related parts, you can use its base part number U1AFS600. There is a maximum RAM si4.5kBe of 4.5kB on this FPGA module, which is necessary to ensure the normal operation of the program. It has a total of 256 pins that are designed for it. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. This module is capable of operating at a maximum temperature of 85°C. 0°C should be higher than the operating temperature. There are 250000 gates that make up its basic building block. There is a device package provided by 256-FPBGA (17x17) as its supplier.
U1AFS600-FG256 Features
114 I/Os
Up to 36864 RAM bits
256 LABs/CLBs
85°C gates
U1AFS600-FG256 Applications
There are a lot of Microsemi Corporation
U1AFS600-FG256 FPGAs applications.
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
U1AFS600-FG256 Relevant information
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